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• Compact 5-lead TSOT packages
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• Low temperature coefficient B grade: 9 ppm/°C A grade: 25 ppm/°C
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• Initial accuracy B grade: ±4 mV maximum (ADR390)A grade: ±6 mV maximum
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| • Ultralow output noise: 5 μV p-p (0.1 Hz to 10 Hz) |
| • Low supply current 3 μA maximum in shutdown 120 μA maximum in operation |
| • No external capacitor required |
| • Output current: 5 mA |
| • Wide temperature range: −40°C to +125°C |
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| CATALOG |
| ADR391BUJZ-REEL7 COUNTRY OF ORIGIN |
ADR391BUJZ-REEL7 PARAMETRIC INFO
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ADR391BUJZ-REEL7 PACKAGE INFO
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ADR391BUJZ-REEL7 MANUFACTURING INFO
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ADR391BUJZ-REEL7 PACKAGING INFO
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ADR391BUJZ-REEL7 EACD MODELS
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| ADR391BUJZ-REEL7 APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Philippines |
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PARAMETRIC INFO
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| Supplier Package |
TSOT |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
0.9(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193AB |
| Package Outline |
Link to Datasheet |
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PACKAGE INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
N/A|Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
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ECAD MODELS
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| APPLICATIONS |
| • Battery-powered instrumentation |
| • Portable medical instrumentation |
| • Data acquisition systems |
| • Industrial process controls |
| • Automotive |
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