|
|
• Ultrawideband frequency range: 9 kHz to 40 GHz
|
• Attenuation range: 0.5 dB steps to 31.5 dB
|
• High RF input power handling: 27 dBm average, 30 dBm peak
|
• Tight distribution in relative phase
|
• No low frequency spurious signals
|
|
| CATALOG |
ADRF5720BCCZN-R7 COUNTRY OF ORIGIN
|
ADRF5720BCCZN-R7 PARAMETRIC INFO
|
ADRF5720BCCZN-R7 PACKAGE INFO
|
ADRF5720BCCZN-R7 MANUFACTURING INFO
|
ADRF5720BCCZN-R7 PACKAGING INFO
|
ADRF5720BCCZN-R7 ECAD MODELS
|
ADRF5720BCCZN-R7 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Korea (Republic of)
|
|
PARAMETRIC INFO
|
| Number of Bits |
6 |
| Maximum Attenuation (dB) |
31.5(Typ) |
| Attenuator Step Size (dB) |
0.5 |
| Minimum Frequency (MHz) |
0.009 |
| Maximum Frequency (MHz) |
40000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Process Technology |
CMOS |
| Minimum Operating Supply Voltage (V) |
3.15|-3.45 |
| Typical Operating Supply Voltage (V) |
3.3|-3.3 |
| Maximum Operating Supply Voltage (V) |
3.45|-3.15 |
| Minimum Hold Time (ns) |
10(Typ) |
| Minimum Setup Time (ns) |
2(Typ) |
| Maximum Supply Current (A) |
0.000117(Typ) |
| Maximum Power Dissipation (mW) |
500 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
LGA EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.75 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Land Grid Array Package, Exposed Pad |
| Package Family Name |
LGA |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS
|
| • Industrial scanners |
| • Test and instrumentation |
| • Cellular infrastructure: 5G millimeter wave |
| • Military radios, radars, electronic counter measures (ECMs) |
| • Microwave radios and very small aperture terminals (VSATs) |
| |
One-stop supplier of IC products