|
|
• Ultrasmall X2QFN Package:
2 mm × 1.5 mm × 0.4 mm
|
• Wide Supply Range: 2 V to 5.5 V
|
• Low Current Consumption:
– Continuous Mode: Only 150 μA
– Single-Shot Mode: Automatic Power Down
|
• Programmable Data Rate:
8 SPS to 860 SPS
|
• Single-Cycle Settling
|
| • Internal Low-Drift Voltage Reference
|
| • Internal Temperature Sensor:
0.5°C (Maximum) Error: 0°C to 70°C |
| • Internal Oscillator |
| • Internal PGA |
| • Four Single-Ended or Two Differential Inputs |
|
| CATALOG |
ADS1118IDGSR COUNTRY OF ORIGIN
|
ADS1118IDGSR PARAMETRIC INFO
|
ADS1118IDGSR PACKAGE INFO
|
ADS1118IDGSR MANUFACTURING INFO
|
ADS1118IDGSR PACKAGING INFO
|
ADS1118IDGSR ECAD MODELS
|
ADS1118IDGSR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| Thailand |
|
PARAMETRIC INFO
|
| Converter Type |
General Purpose |
| Input Type |
Voltage |
| Architecture |
Delta-Sigma |
| Resolution |
16bit |
| Number of ADCs |
1 |
| Sampling Rate |
860sps |
| Digital Interface Type |
Serial (3-Wire, 4-Wire, SPI) |
| Voltage Reference |
Internal |
| Input Signal Type |
Single-Ended|Differential |
| Polarity of Input Voltage |
Bipolar |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-60 |
| Maximum Storage Temperature (°C) |
150 |
| Integral Nonlinearity Error |
1LSB |
| Sample and Hold |
No |
| Number of Input Channels |
4|2 |
| Single-Ended Input |
Yes |
| Differential Input |
Yes |
| Input Voltage |
±0.256V/±0.512V/±1.024V/±2.048V/±4.096V/±6.144V |
| No Missing Codes (bit) |
16 |
| Full Scale Error |
0.15%FSR |
| Voltage Supply Source |
Single |
| Minimum Single Supply Voltage (V) |
2 |
| Typical Single Supply Voltage (V) |
3.3 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Digital Supply Support |
No |
| Typical Power Dissipation (mW) |
0.9 |
|
|
PACKAGE INFO
|
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Temperature Measurement:
– Thermocouple Measurement
– Cold-Junction Compensation
– Thermistor Measurement
|
| • Portable Instrumentation
|
• Factory Automation and Process Controls
|
|
| |
| |
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