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• Complete Front-End for Bridge Sensor
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• Onboard PGA with Gain of 64 or 128
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• Onboard Oscillator
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• 18-Bit Noise-Free Resolution
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• Selectable 10SPS or 80SPS Data Rates
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• Simple, Pin-Driven Control
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• Two-Wire Serial Digital Interface
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• Tiny 16-pin TSSOP Package
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• Supply Range: 2.7V to 5.3V
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• –40°C to +85°C Temperature Range
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|
| CATALOG |
ADS1230IPWR COUNTRY OF ORIGIN
|
ADS1230IPWR PARAMETRIC INFO
|
ADS1230IPWR PACKAGE INFO
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ADS1230IPWR MANUFACTURING INFO
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ADS1230IPWR PACKAGING INFO
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ADS1230IPWR ECAD MODELS
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ADS1230IPWR APPLICATIONS
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COUNTRY OF ORIGIN
|
Malaysia
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China
|
Taiwan (Province of China)
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|
PARAMETRIC INFO
|
| Converter Type |
General Purpose |
| Input Type |
Voltage |
| Architecture |
Delta-Sigma |
| Resolution |
20bit |
| Number of ADCs |
1 |
| Sampling Rate |
80sps |
| Digital Interface Type |
Serial (2-Wire) |
| Voltage Reference |
External |
| Input Signal Type |
Single-Ended|Differential |
| Polarity of Input Voltage |
Bipolar |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Integral Nonlinearity Error |
±10ppm(Typ) |
| Sample and Hold |
No |
| Number of Input Channels |
1 |
| Single-Ended Input |
Yes |
| Differential Input |
Yes |
| Input Voltage |
±2.5V |
| No Missing Codes (bit) |
20 |
| Full Scale Error |
±0.8%FSR(Typ) |
| Differential Nonlinearity |
±1LSB |
| Voltage Supply Source |
Analog and Digital |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
5 |
| Maximum Single Supply Voltage (V) |
5.3 |
| Digital Supply Support |
Yes |
| Typical Power Dissipation (mW) |
5 |
| Maximum Power Dissipation (mW) |
7.7 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |

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APPLICATIONS
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• Weigh Scales
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• Strain Gauges
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| • Pressure Sensors |
| • Industrial Process Control |
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