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• Embedded Microcontroller– 16-Bit RISC Architecture up to 24-MHz Clock– Wide Supply Voltage Range (2 V to 3.6 V)– –40°C to 85°C Operation
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• Optimized Ultra-Low-Power Modes– Active Mode: 81.4 µA/MHz (Typical)– Standby (LPM3 With VLO): 6.3 µA (Typical)– Real-Time Clock (RTC) (LPM3.5 With Crystal):1.5 µA (Typical)– Shutdown (LPM4.5): 0.32 µA (Typical)
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• Ultra-Low-Power Ferroelectric RAM (FRAM)– Up to 16KB of Nonvolatile Memory– Ultra-Low-Power Writes– Fast Write at 125 ns per Word (16KB in 1 ms)– Built-In Error Correction Coding (ECC) and Memory Protection Unit (MPU)– Universal Memory = Program + Data + Storage– 1015 Write Cycle Endurance– Radiation Resistant and Nonmagnetic
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| • Intelligent Digital Peripherals– 32-Bit Hardware Multiplier (MPY)– Three-Channel Internal DMA– Real-Time Clock (RTC) With Calendar andAlarm Functions– Five 16-Bit Timers With up to Three Capture/Compare Registers– 16-Bit Cyclic Redundancy Checker (CRC) |
| • High-Performance Analog– 16-Channel Analog Comparator With Voltage Reference and Programmable Hysteresis– 12-Channel 10-Bit Analog-to-Digital Converter(ADC) With Internal Reference and Sample-andHold– 200 ksps at 100-µA Consumption |
| • Enhanced Serial Communication– eUSCI_A0 and eUSCI_A1 Support:– UART With Automatic Baud-Rate Detection– IrDA Encode and Decode– SPI– eUSCI_B0 Supports:– I 2C With Multiple-Slave Addressing– SPI– Hardware UART Bootloader (BSL) |
| • Power Management System– Fully Integrated LDO– Supply Voltage Supervisor for Core and Supply Voltages With Reset Capability– Always-On Zero-Power Brownout Detection– Serial Onboard Programming With No External Voltage Needed |
| • Flexible Clock System– Fixed-Frequency DCO With Six Selectable Factory-Trimmed Frequencies (Device Dependent)– Low-Power Low-Frequency Internal Clock Source (VLO)– 32-kHz Crystals (LFXT)– High-Frequency Crystals (HFXT) |
| • Development Tools and Software– Free Professional Development Environment(Code Composer Studio™ IDE)– Low-Cost Full-Featured Kit(MSP-EXP430FR5739)– Full Development Kit (MSP-FET430U40A)– Target Board (MSP-TS430RHA40A) |
| • Family Members– See Family Members for Available DeviceVariants and Packages– For Complete Module Descriptions, See the MSP430FR57xx Family User's Guide |
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| CATALOG |
| ADS1298IPAGR COUNTRY OF ORIGIN |
ADS1298IPAGR PARAMETRIC INFO
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ADS1298IPAGR PACKAGE INFO
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ADS1298IPAGR MANUFACTURING INFO
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ADS1298IPAGR PACKAGING INFO
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ADS1298IPAGR EACD MODELS
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| ADS1298IPAGR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Philippines |
| Taiwan (Province of China) |
| Thailand |
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PARAMETRIC INFO
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| Category |
General Purpose |
| Type |
General Purpose |
| Number of ADCs |
8 |
| Sampling Rate (ksps) |
32 |
| Resolution (bit) |
24 |
| Number of Channels per Chip |
8 |
| Number of ADC Inputs |
1 |
| Interface Type |
Serial (SPI) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-60 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Analog|Digital |
| Minimum Operating Supply Voltage (V) |
1.65|2.7 |
| Typical Operating Supply Voltage (V) |
1.8|3 |
| Maximum Operating Supply Voltage (V) |
3.6|5.25 |
| Typical Supply Current (mA) |
3.1 |
|
|
PACKAGE INFO
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| Supplier Package |
TQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10.2(Max) |
| Package Width (mm) |
10.2(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12.2(Max) |
| Package Overall Width (mm) |
12.2(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026ACD |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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|
PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| •
Medical Instrumentation (ECG, EMG, and EEG):Patient Monitoring; Holter, Event, Stress, and VitalSigns Including ECG, AED, Telemedicine Bispectral Index (BIS), Evoked Audio Potential (EAP), Sleep Study Monitor
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