ADS6422IRGCR Texas Instruments QUAD CHANNEL, 12-BIT, 105/80/65 MSPS ADC WITH SERIAL LVDS INTERFACE

label:
2025/03/5 75
ADS6422IRGCR Texas Instruments QUAD CHANNEL, 12-BIT, 105/80/65 MSPS ADC WITH SERIAL LVDS INTERFACE


• 12-Bit Resolution With No Missing Codes
• Simultaneous Sample and Hold
• 3.3-V Analog and Digital Supply
• 64 QFN Package (9 mm × 9 mm)
• Pin Compatible 14-Bit Family (ADS644X -SLAS531A)


CATALOG
ADS6422IRGCR COUNTRY OF ORIGIN
ADS6422IRGCR PARAMETRIC INFO
ADS6422IRGCR PACKAGE INFO
ADS6422IRGCR MANUFACTURING INFO
ADS6422IRGCR PACKAGING INFO
ADS6422IRGCR ECAD MODELS
ADS6422IRGCR APPLICATIONS


COUNTRY OF ORIGIN
China
Malaysia
Philippines


PARAMETRIC INFO
Converter Type General Purpose
Input Type Voltage
Architecture Pipelined
Resolution 12bit
Number of ADCs 4
Sampling Rate 65Msps
Digital Interface Type Serial (1-Wire, 2-Wire)|LVDS
Voltage Reference Internal|External
Input Signal Type Differential
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Integral Nonlinearity Error ±2LSB
Signal to Noise Ratio 71.4dBFS(Typ)
Sample and Hold Yes
Number of Input Channels 4
Single-Ended Input No
Differential Input Yes
Input Voltage 2Vp-p
No Missing Codes (bit) 12
Full Scale Error ±1%FSR
Differential Nonlinearity -0.9/1.8LSB
Voltage Supply Source Analog and Digital
Minimum Single Supply Voltage (V) 3
Typical Single Supply Voltage (V) 3.3
Maximum Single Supply Voltage (V) 3.6
Digital Supply Support No
Typical Power Dissipation (mW) 1050
Maximum Power Dissipation (mW) 1250


PACKAGE INFO
Supplier Package VQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 64
Lead Shape No Lead
PCB 64
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 9.15(Max)
Package Width (mm) 9.15(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 9.15(Max)
Package Overall Width (mm) 9.15(Max)
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000


ECAD MODELS
APPLICATIONS
• Base-station IF Receivers
• Diversity Receivers
• Medical Imaging
• Test Equipment
Продукт RFQ