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• 12-Bit Resolution With No Missing Codes
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• Simultaneous Sample and Hold
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• 3.3-V Analog and Digital Supply
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• 64 QFN Package (9 mm × 9 mm)
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• Pin Compatible 14-Bit Family (ADS644X -SLAS531A)
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CATALOG |
ADS6422IRGCR COUNTRY OF ORIGIN
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ADS6422IRGCR PARAMETRIC INFO
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ADS6422IRGCR PACKAGE INFO
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ADS6422IRGCR MANUFACTURING INFO
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ADS6422IRGCR PACKAGING INFO
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ADS6422IRGCR ECAD MODELS
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ADS6422IRGCR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Malaysia
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Philippines
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PARAMETRIC INFO
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Converter Type |
General Purpose |
Input Type |
Voltage |
Architecture |
Pipelined |
Resolution |
12bit |
Number of ADCs |
4 |
Sampling Rate |
65Msps |
Digital Interface Type |
Serial (1-Wire, 2-Wire)|LVDS |
Voltage Reference |
Internal|External |
Input Signal Type |
Differential |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Integral Nonlinearity Error |
±2LSB |
Signal to Noise Ratio |
71.4dBFS(Typ) |
Sample and Hold |
Yes |
Number of Input Channels |
4 |
Single-Ended Input |
No |
Differential Input |
Yes |
Input Voltage |
2Vp-p |
No Missing Codes (bit) |
12 |
Full Scale Error |
±1%FSR |
Differential Nonlinearity |
-0.9/1.8LSB |
Voltage Supply Source |
Analog and Digital |
Minimum Single Supply Voltage (V) |
3 |
Typical Single Supply Voltage (V) |
3.3 |
Maximum Single Supply Voltage (V) |
3.6 |
Digital Supply Support |
No |
Typical Power Dissipation (mW) |
1050 |
Maximum Power Dissipation (mW) |
1250 |
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PACKAGE INFO
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Supplier Package |
VQFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
64 |
Lead Shape |
No Lead |
PCB |
64 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
9.15(Max) |
Package Width (mm) |
9.15(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
9.15(Max) |
Package Overall Width (mm) |
9.15(Max) |
Package Overall Height (mm) |
1(Max) |
Seated Plane Height (mm) |
1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
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ECAD MODELS
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APPLICATIONS |
• Base-station IF Receivers |
• Diversity Receivers |
• Medical Imaging |
• Test Equipment |
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