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• 1-MHz Sample Rate Serial Device |
• 12-Bit Resolution |
• Zero Latency |
• 20-MHz Serial Interface |
• Supply Range: 2.35 V to 5.25 V |
• Typical Power Dissipation at 1 MSPS:
– 3.9 mW at 3-V VDD
– 7.5 mW at 5-V VDD |
• INL ±1.25 LSB Maximum, ±0.65 LSB (Typical) |
• DNL ±1 LSB Maximum, +0.4 / –0.65 LSB (Typical) |
• Typical AC Performance:
– 72.25-dB SINAD, –84-dB THD |
• Unipolar Input Range: 0 V to VDD |
• Power Down Current: 1 µA |
• Wide Input Bandwidth: 15 MHz at 3 dB |
• 6-Pin SOT-23 and SC70 Packages |
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CATALOG |
ADS7886SDCKR COUNTRY OF ORIGIN |
ADS7886SDCKR PARAMETRIC INFO |
ADS7886SDCKR PACKAGE INFO |
ADS7886SDCKR MANUFACTURING INFO |
ADS7886SDCKR PACKAGING INFO |
ADS7886SDCKR ECAD MODELS |
ADS7886SDCKR FUNCTIONAL BLOCK DIAGRAM |
ADS7886SDCKR APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Korea (Republic of) |
Taiwan (Province of China) |
Thailand |
United States of America |
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PARAMETRIC INFO |
Converter Type |
General Purpose |
Input Type |
Voltage |
Architecture |
SAR |
Resolution |
12bit |
Number of ADCs |
1 |
Sampling Rate |
1Msps |
Digital Interface Type |
Serial |
Voltage Reference |
Supply |
Input Signal Type |
Single-Ended |
Polarity of Input Voltage |
Unipolar |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Integral Nonlinearity Error |
±2LSB |
Signal to Noise Ratio |
72.25dB(Typ) |
Sample and Hold |
Yes |
Number of Input Channels |
1 |
Single-Ended Input |
Yes |
Differential Input |
No |
Input Voltage |
3.3V |
No Missing Codes (bit) |
11 |
Full Scale Error |
±1.75LSB |
Differential Nonlinearity |
±2LSB |
Voltage Supply Source |
Single |
Minimum Single Supply Voltage (V) |
2.35 |
Typical Single Supply Voltage (V) |
3.3 |
Maximum Single Supply Voltage (V) |
5.25 |
Digital Supply Support |
No |
Typical Power Dissipation (mW) |
7.5 |
Maximum Power Dissipation (mW) |
10 |
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PACKAGE INFO |
Supplier Package |
SC-70 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
Gull-wing |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
2.15(Max) |
Package Width (mm) |
1.4(Max) |
Package Height (mm) |
1(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
2.15(Max) |
Package Overall Width (mm) |
2.4(Max) |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Base Band Converters in Radio
Communication |
• Motor Current and Bus Voltage Sensors in Digital
Drives |
• Optical Networking (DWDM, MEMS Based
Switching) |
• Optical Sensors |
• Battery-Powered Systems |
• Medical Instrumentations |
• High-Speed Data Acquisition Systems
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• High-Speed Closed-Loop Systems
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