|
|
• Sample Rate: 250 kHz
|
• 16-Bit Resolution
|
• Zero Latency at Full Speed
|
| • Uses Internal Clock for Conversion
|
| • Package: VSSOP-10 |
| • Power Dissipation During Power-Down State:
– 0.25 μW (typ) |
| • Power Scales Linearly with Speed:
– 1.75 mW at 25 kSPS
|
| • Low-Power Dissipation: – 17.5 mW (typ) at 250 kSPS
|
| • SPI™-Compatible Serial Interface with Daisy Chain Option |
|
| CATALOG |
| ADS8339IDGST COUNTRY OF ORIGIN |
ADS8339IDGST PARAMETRIC INFO
|
ADS8339IDGST PACKAGE INFO
|
ADS8339IDGST MANUFACTURING INFO
|
ADS8339IDGST PACKAGING INFO
|
ADS8339IDGST ECAD MODELS
|
| ADS8339IDGST APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Taiwan (Province of China) |
| Philippines |
| Thailand |
|
PARAMETRIC INFO
|
| Converter Type |
General Purpose |
| Input Type |
Voltage |
| Architecture |
SAR |
| Resolution |
16bit |
| Number of ADCs |
1 |
| Sampling Rate |
250ksps |
| Digital Interface Type |
Serial (3-Wire, 4-Wire, SPI) |
| Voltage Reference |
External |
| Input Signal Type |
Pseudo-Differential |
| Polarity of Input Voltage |
Unipolar |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Integral Nonlinearity Error |
±2LSB |
| Signal to Noise Ratio |
93.6dB(Typ) |
| Sample and Hold |
Yes |
| Number of Input Channels |
1 |
| Single-Ended Input |
No |
| Differential Input |
Yes |
| Input Voltage |
5.5V |
| Differential Nonlinearity |
±1LSB |
| Voltage Supply Source |
Single |
| Minimum Single Supply Voltage (V) |
4.5 |
| Typical Single Supply Voltage (V) |
5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Digital Supply Support |
No |
| Typical Power Dissipation (mW) |
17.5 |
|
|
PACKAGE INFO
|
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Battery-Powered Equipment
|
• Data Acquisition Systems
|
• Instrumentation and Process Controls
|
| • Medical Electronics |
| • Optical Networking
|
|
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