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• 16-Bit ADC with Integrated Analog Front-End |
• Simultaneous Sampling: 6-Channels |
• Pin-Programmable Bipolar Inputs: ±10 V and ±5 V |
• High Input Impedance: 1 MΩ |
• 5-V Analog Supply: 2.3-V to 5-V Digital Supply |
• Overvoltage Input Clamp with 7-kV ESD |
• Low-Drift, On-Chip Reference (2.5 V) and Buffer |
• Excellent Performance:
– 250-kSPS Max Throughput per Channel
– DNL: ±0.35 LSB; INL: ±0.45 LSB
– SNR: 96.4 dB; THD: −114 dB |
• Over Temperature Performance:
– Max Offset Drift: 3 ppm/°C
– Gain Drift: 6 ppm/°C |
• On-Chip Digital Filter for Oversampling
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• Flexible Parallel, Byte, and Serial Interface |
• Temperature Range: –40°C to +125°C |
• Package: 64-Pin LQFP |
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CATALOG |
ADS8586SIPMR COUNTRY OF ORIGIN |
ADS8586SIPMR PARAMETRIC INFO |
ADS8586SIPMR PACKAGE INFO |
ADS8586SIPMR MANUFACTURING INFO |
ADS8586SIPMR PACKAGING INFO |
ADS8586SIPMR ECAD MODELS |
ADS8586SIPMR FUNCTIONAL BLOCK DIAGRAM |
ADS8586SIPMR APPLICATIONS
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COUNTRY OF ORIGIN |
Taiwan (Province of China) |
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PARAMETRIC INFO |
Converter Type |
General Purpose |
Input Type |
Voltage |
Architecture |
SAR |
Resolution |
16bit |
Number of ADCs |
6 |
Sampling Rate |
250ksps |
Digital Interface Type |
Byte|Parallel|Serial |
Voltage Reference |
Internal|External |
Input Signal Type |
Single-Ended |
Polarity of Input Voltage |
Bipolar |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Integral Nonlinearity Error |
±1.5LSB |
Signal to Noise Ratio |
92.7dB(Typ) |
Sample and Hold |
Yes |
Number of Input Channels |
6 |
Single-Ended Input |
Yes |
Differential Input |
No |
Input Voltage |
±5V/±10V |
No Missing Codes (bit) |
16 |
Full Scale Error |
±96LSB |
Differential Nonlinearity |
±0.5LSB |
Voltage Supply Source |
Analog and Digital |
Minimum Single Supply Voltage (V) |
4.75 |
Typical Single Supply Voltage (V) |
5 |
Maximum Single Supply Voltage (V) |
5.25 |
Digital Supply Support |
Yes |
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PACKAGE INFO |
Supplier Package |
LQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
64 |
Lead Shape |
Gull-wing |
PCB |
64 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
10.2(Max) |
Package Width (mm) |
10.2(Max) |
Package Height (mm) |
1.4 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
12.2(Max) |
Package Overall Width (mm) |
12.2(Max) |
Package Overall Height (mm) |
1.6(Max) |
Seated Plane Height (mm) |
1.6(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Low Profile Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026 |
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MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS
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• Monitoring and Control for Power Grids |
• Protection Relays |
• Multi-Phase Motor Controls
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• Industrial Automation and Controls |
• Multichannel Data Acquisition Systems |
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