
|
| |
• 13-bit temperature-to-digital converter
|
• −40°C to +150°C operating temperature range
|
• ±0.5°C typical accuracy
|
| • 0.03125°C temperature resolution
|
| • Shutdown current of 1 μA |
| • Power dissipation of 0.631 mW at VDD = 3.3 V |
| • SPI- and DSP-compatible serial interface |
| • Shutdown mode |
| • Space-saving SOT-23 and MSOP packages |
| • Compatible with AD7814 |
| |
| CATALOG |
| ADT7301ARTZ-REEL7 COUNTRY OF ORIGIN |
ADT7301ARTZ-REEL7 PARAMETRIC INFO
|
ADT7301ARTZ-REEL7 PACKAGE INFO
|
ADT7301ARTZ-REEL7 MANUFACTURING INFO
|
ADT7301ARTZ-REEL7 PACKAGING INFO
|
ADT7301ARTZ-REEL7 EACD MODELS
|
| ADT7301ARTZ-REEL7 FUNCTIONAL BLOCK DIAGRAM |
| ADT7301ARTZ-REEL7 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
PARAMETRIC INFO
|
| Function |
Temperature Sensor |
| Interface Type |
Serial (4-Wire, SPI) |
| Resolution (bit) |
13 |
| Output Type |
Digital |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Temperature Sensing (°C) |
150 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Minimum Temperature Sensing (°C) |
-40 |
| Operating Range |
-40°C to 150°C |
| Operating Temperature (°C) |
-40 to 150 |
| Maximum Supply Current (uA) |
400 |
| Maximum Power Dissipation (mW) |
1.41(Typ) |
| Accuracy |
±1°C |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Operating Supply Voltage (V) |
2.7 to 5.25 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
1.15 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|

|
|
| FUNCTIONAL BLOCK DIAGRAM |
|
| |
| APPLICATIONS |
| • Medical equipment |
| • Automotive Environmental controls Oil temperature Hydraulic systems |
| • Cellular phones |
| • Hard disk drives |
• Personal computers
|
• Office equipment
|
| • Portable and Battery-Powered Equipment |
| • Domestic appliances |
| • Process control |
| |