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• Controls and Monitors Up to 4 Fans
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• High and Low Frequency Fan Drive Signal
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• 1 On-Chip and 2 Remote Temperature Sensors
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• Series Resistance Cancellation on the Remote Channel
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• Extended Temperature Measurement Range, Up to 191°C
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• Dynamic TMIN Control Mode Intelligently Optimizes System Acoustics
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| CATALOG |
ADT7473ARQZ-1RL COUNTRY OF ORIGIN
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ADT7473ARQZ-1RL PARAMETRIC INFO
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ADT7473ARQZ-1RL PACKAGE INFO
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ADT7473ARQZ-1RL MANUFACTURING INFO
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ADT7473ARQZ-1RL PACKAGING INFO
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ADT7473ARQZ-1RL ECAD MODELS
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COUNTRY OF ORIGIN
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Philippines
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Maximum Operating Supply Current (mA) |
3 |
| Control Method |
PWM |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Temperature Flag |
Opr |
| Interface Type |
SMBus |
| Number of Supported Fans |
4 |
| Over Temperature Alert |
No |
| Maximum Temperature Accuracy (°C) |
±2.5 |
| System Shutdown |
No |
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|
PACKAGE INFO
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| Supplier Package |
QSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.64 |
| Package Length (mm) |
4.89 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.24(Min) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3(Max) |
| Package Material |
Plastic |
| Package Description |
Quarter Size Outline Package Or Quality Small Outline Package |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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| PACKAGING INFO |
| Packaging Suffix |
RL |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
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| |
| ECAD MODELS |
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| |
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