 |
|
| ► Bidirectional I2C communication
|
| ► Open-drain interfaces |
| ► Suitable for hot swap applications |
| ► 30 mA current sink capability
|
| ► 1000 kHz operation |
| ► 3.0 V to 5.5 V supply/logic levels
|
| ► 8-lead, RoHS compliant SOIC package |
| ► High temperature operation: 125°C |
| ► Qualified for automotive applications
|
► Safety and regulatory approvals
► DIN VDE V 0884-11:2017-01
► Reinforced VIORM = 560 V peak
► 2500 V rms for 1 minute per UL 1577
► IEC/EN/CSA 62368-1
► IEC/CSA 61010-1
► CAN/CSA-C22.2 No. 14-18
► GB4943.1-2011 |
|
| CATALOG |
| ADUM1251ARZ-RL7 COUNTRY OF ORIGIN |
| ADUM1251ARZ-RL7 PARAMETRIC INFO |
| ADUM1251ARZ-RL7 PACKAGE INFO |
| ADUM1251ARZ-RL7 MANUFACTURING INFO |
| ADUM1251ARZ-RL7 PACKAGING INFO |
| ADUM1251ARZ-RL7 ECAD MODELS |
| ADUM1251ARZ-RL7 FUNCTIONAL BLOCK DIAGRAMS |
| ADUM1251ARZ-RL7 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
|
| PARAMETRIC INFO |
| Number of Channels per Chip |
2 |
| Type |
I2C |
| Isolated Power |
No |
| Output Type |
CMOS |
| Minimum Isolation Voltage (Vrms) |
2500 |
| Maximum Pulse Width Distortion (ns) |
215 |
| Minimum Common Mode Rejection (kV/us) |
25 |
| Maximum Working Insulation Voltage |
560Vp |
| Maximum Fall Time (ns) |
120 |
| Maximum Propagation Delay Time (tPHL) (ns) |
150 |
| Maximum Propagation Delay Time (tPLH) (ns) |
150 |
| Maximum Data Rate |
1Mbps |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Coupling Type |
Magnetic Coupling |
| Forward/Reverse Channels |
2/1 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
|
| PACKAGE INFO |
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging Suffix |
RL7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
|
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAMS |
 |
|
| APPLICATIONS |
| ► Isolated I2C, SMBus, or PMBus interfaces
|
| ► Multilevel I2C interfaces
|
| ► Power supplies |
| ► Networking
|
| ► Power over Ethernet |
| ► Hybrid electric vehicle battery management |
| |
|
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