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• Qualified for automotive applications
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• Bidirectional communication
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• 3 V/5 V level translation
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• High temperature operation: 125°C
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• High data rate: dc to 90 Mbps (NRZ)
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| CATALOG |
ADUM1401ARWZ-RL COUNTRY OF ORIGIN
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ADUM1401ARWZ-RL PARAMETRIC INFO
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ADUM1401ARWZ-RL PACKAGE INFO
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ADUM1401ARWZ-RL MANUFACTURING INFO
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ADUM1401ARWZ-RL PACKAGING INFO
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ADUM1401ARWZ-RL ECAD MODELS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Number of Channels per Chip |
4 |
| Type |
General Purpose |
| Isolated Power |
No |
| Output Type |
CMOS |
| Minimum Isolation Voltage (Vrms) |
2500 |
| Minimum Pulse Width (ns) |
1000 |
| Maximum Pulse Width Distortion (ns) |
40 |
| Minimum Common Mode Rejection (kV/us) |
25 |
| Maximum Working Insulation Voltage |
560Vp |
| Maximum Fall Time (ns) |
2.5(Typ) |
| Maximum Rise Time (ns) |
2.5(Typ) |
| Maximum Propagation Delay Time (tPHL) (ns) |
100 |
| Maximum Propagation Delay Time (tPLH) (ns) |
100 |
| Maximum Propagation Delay Skew (ns) |
50 |
| Maximum Data Rate |
1Mbps |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Maximum Quiescent Supply Current (mA) |
2.4/1.8 |
| Coupling Type |
Magnetic Coupling |
| Forward/Reverse Channels |
3/1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SOIC W |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10.3 |
| Package Width (mm) |
7.5 |
| Package Height (mm) |
2.3 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.3 |
| Package Overall Width (mm) |
10.33 |
| Package Overall Height (mm) |
2.5 |
| Seated Plane Height (mm) |
2.5 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.41 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Wide Body |
| Package Family Name |
SO |
| Jedec |
MS-013AA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
2.35 |
| Minimum PACKAGE_DIMENSION_H |
2.25 |
| Maximum PACKAGE_DIMENSION_L |
10.5 |
| Minimum PACKAGE_DIMENSION_L |
10.1 |
| Maximum PACKAGE_DIMENSION_W |
7.6 |
| Minimum PACKAGE_DIMENSION_W |
7.4 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
2.65 |
| Minimum Seated_Plane_Height |
2.35 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.2 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.84 |
| Terminal Thickness (mm) |
0.27 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
RL |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
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| ECAD MODELS |
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