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• Supports up to 17 MHz SPI clock speed
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• 4 high speed, low propagation delay, SPI signal isolation channels
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• Supports up to 4 slave devices
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| • 20-lead SSOP package with 5.1 mm creepage
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| • High temperature operation: 125°C |
| • High common-mode transient immunity: >25 kV/µs |
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| CATALOG |
| ADuM3154ARSZ COUNTRY OF ORIGIN |
ADuM3154ARSZ PARAMETRIC INFO
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ADuM3154ARSZ PACKAGE INFO
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ADuM3154ARSZ MANUFACTURING INFO
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ADuM3154ARSZ PACKAGING INFO
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ADuM3154ARSZ ECAD MODELS
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| ADuM3154ARSZ FUNCTIONAL BLOCK DIAGRAM |
| ADuM3154ARSZ APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
PARAMETRIC INFO
|
| Number of Channels per Chip |
4 |
| type |
SPI |
| Isolated Power |
no |
| Output Type |
CMOS |
| Minimum Isolation Voltage (Vrms) |
3750 |
| Minimum Pulse Width (ns) |
25 |
| Maximum Pulse Width Distortion (ns) |
3 |
| Minimum Common Mode Rejection (kV/us) |
25 |
| Maximum Working Insulation Voltage |
560Vp |
| Maximum Fall Time (ns) |
2.5(Typ) |
| Maximum Rise Time (ns) |
2.5(Typ) |
| Maximum Propagation Delay Time (tPHL) (ns) |
27 |
| Maximum Propagation Delay Time (tPLH) (ns) |
27 |
| Maximum Data Rate |
1MHz |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Rating |
Industrial |
| Maximum Quiescent Supply Current (mA) |
4.2/6.1 |
| Coupling Type |
Magnetic Coupling |
| Forward/Reverse Channels |
5/1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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|
PACKAGE INFO
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| Supplier packaging |
SSOP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
20 |
| Pin shape |
Gull-wing |
| PCB |
20 |
| ears |
N/R |
| Pin spacing (mm) |
0.65 |
| Package length (mm) |
7.2 |
| Package width (mm) |
5.3 |
| Package height (mm) |
1.75 |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
2(Max) |
| Install |
Surface Mount |
| Packaging materials |
Plastic |
| package instruction |
Shrink Small Outline Package |
| Package series name |
SO |
| JEDEC |
MO-150AE |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Package |
Tube |
| Packing quantity |
66 |
| packaging type file |
Link to datasheet |
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|
ECAD MODELS
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FUNCTIONAL BLOCK DIAGRAM
|
 |
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APPLICATIONS
|
• Industrial programmable logic controllers (PLCs)
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• Sensor isolation
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