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| CATALOG |
| ADV212BBCZ-150 COUNTRY OF ORIGIN |
ADV212BBCZ-150 PARAMETRIC INFO
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ADV212BBCZ-150 PACKAGE INFO
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ADV212BBCZ-150 MANUFACTURING INFO
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ADV212BBCZ-150 PACKAGING INFO
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ADV212BBCZ-150 ECAD MODELS
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ADV212BBCZ-150 APPLICATIONS
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COUNTRY OF ORIGIN
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| Singapore |
Taiwan (Province of China)
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PARAMETRIC INFO
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| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Commercial |
| Power Supply Type |
Analog |
| Minimum Operating Supply Voltage (V) |
1.425|2.375|3.135 |
| Typical Operating Supply Voltage (V) |
1.5|2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
1.575|2.625|3.465 |
| Typical Supply Current (mA) |
380 |
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PACKAGE INFO
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| Supplier Package |
CSP-BGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
144 |
| Lead Shape |
Ball |
| PCB |
144 |
| Tab |
N/R |
| Pin Pitch (mm) |
1 |
| Package Length (mm) |
13 |
| Package Width (mm) |
13 |
| Package Height (mm) |
1.21 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.85(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Chip Scale Ball Grid Array Package |
| Package Family Name |
BGA |
| Jedec |
MO-192AAD-1 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
160 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Networked video and image distribution systems
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• Wireless video and image distribution
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• Image archival/retrieval
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• Digital CCTV and surveillance systems
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• Digital cinema systems
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• Professional video editing and recording
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• Digital still cameras
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• Digital camcorders
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