|
|
• 330 MSPS throughput rate
|
• Triple 8-bit DACs
|
• RS-343A-/RS-170-compatible output
|
• Complementary outputs
|
• DAC output current range: 2.0 mA to 26.5 mA
|
• TTL-compatible inputs
|
|
| CATALOG |
ADV7125BCPZ170-RL COUNTRY OF ORIGIN
|
ADV7125BCPZ170-RL PARAMETRIC INFO
|
ADV7125BCPZ170-RL PACKAGE INFO
|
ADV7125BCPZ170-RL MANUFACTURING INFO
|
ADV7125BCPZ170-RL PACKAGING INFO
|
ADV7125BCPZ170-RL ECAD MODELS
|
ADV7125BCPZ170-RL APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Korea (Republic of)
|
Singapore
|
|
PARAMETRIC INFO
|
| Architecture |
Segment |
| Resolution |
8bit |
| Number of DAC Channels |
3 |
| Number of Outputs per Chip |
3 |
| Conversion Rate |
170Msps |
| Converter Type |
Video |
| Output Type |
Current |
| Voltage Reference |
Internal|External |
| Digital Interface Type |
Parallel |
| Output Polarity |
Unipolar |
| Integral Nonlinearity Error |
±1LSB |
| Full Scale Error |
±5%FSR |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Minimum Single Supply Voltage (V) |
3 |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Maximum Single Supply Voltage (V) |
5.25 |
| Digital Supply Support |
No |
| Maximum Power Dissipation (mW) |
30(Min) |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
No Lead |
| PCB |
48 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
7 |
| Package Width (mm) |
7 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VKKD-2 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
RL |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
 |
|
| APPLICATIONS |
| • Digital video systems |
| • High resolution color graphics |
| • Digital radio modulation |
| • Image processing |
| • Instrumentation |
| • Video signal reconstruction |
| |
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