|
| |
• High performance, single-/dual-axis accelerometer on a single IC chip
|
• 5 mm × 5 mm × 2 mm LCC package
|
• 1 mg resolution at 60 Hz
|
| • Low power: 700 µA at VS = 5 V (typical) |
| • High zero g bias stability |
| • High sensitivity accuracy |
| • −40°C to +125°C temperature range |
| • X and Y axes aligned to within 0.1° (typical) |
| • Bandwidth adjustment with a single capacitor |
| • Single-supply operation |
| |
| CATALOG |
| ADXL103CE-REEL COUNTRY OF ORIGIN |
ADXL103CE-REEL PARAMETRIC INFO
|
ADXL103CE-REEL PACKAGE INFO
|
ADXL103CE-REEL MANUFACTURING INFO
|
ADXL103CE-REEL PACKAGING INFO
|
ADXL103CE-REEL EACD MODELS
|
| ADXL103CE-REEL FUNCTIONAL BLOCK DIAGRAMS |
| ADXL103CE-REEL APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Korea (Republic of) |
| United States of America |
| Philippines |
|
PARAMETRIC INFO
|
| Acceleration (g) |
±1.7 |
| Axis Type |
Single |
| Device Sensitivity Range |
960mV/g to 1040mV/g |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Supplier Temperature Grade |
Industrial |
| Output Type |
Analog |
| Resonant Frequency (kHz) |
5.5 |
| Operating Supply Voltage (V) |
3 to 6 |
| Acceleration Range (g) |
±1.5 to ±3 |
|
|
PACKAGE INFO
|
| Supplier Package |
CLLCC |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
1.98 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
5 |
| Package Overall Height (mm) |
1.98 |
| Seated Plane Height (mm) |
1.98 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Ceramic |
| Package Description |
Ceramic Leadless Chip Carrier |
| Package Family Name |
LCC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
W |
|
|
PACKAGING INFO
|
| Packaging Suffix |
REEL |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
13 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| FUNCTIONAL BLOCK DIAGRAMS |
 |
|
| APPLICATIONS |
| • Vehicle dynamic controls
|
| • Electronic chassis controls |
| • Platform stabilization/leveling |
| • Navigation |
| • Alarms and motion detectors |
| • High accuracy, 2-axis tilt sensing |
| • Vibration monitoring and compensation |
| • Abuse event detection |
| |
One-stop supplier of IC products