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• Full compatibility with the optical performance
requirements of the FDDI PMD standard
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• Full compatibility with the FDDI LCF-PMD standard
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• Full compatibility with the optical performance
requirements of the ATM 100-Mb/s physical layer
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• Full compatibility with the optical performance
requirements of 100BASE-FX version of IEEE802.3u |
• Multisourced 1 × 9 package style with choice of duplex SC
or duplex ST1 receptacle |
• Wave solder and aqueous wash process compatible |
• Single +3.3V or +5V power supply |
• RoHS compliance |
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CATALOG |
AFBR-5803TZ COUNTRY OF ORIGIN |
AFBR-5803TZ PARAMETRIC INFO
|
AFBR-5803TZ PACKAGE INFO
|
AFBR-5803TZ MANUFACTURING INFO
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AFBR-5803TZ APPLICATIONS
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COUNTRY OF ORIGIN |
Philippines |
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PARAMETRIC INFO
|
Type |
TX/RX |
Maximum Data Rate |
125MBd |
Average Optical Output Power (dBm) |
-23.5 to -14 |
Emitter Type |
LED |
Connector Type |
ST |
Peak Wavelength (nm) |
1308/1380(Max) |
Fiber Mode |
Multi Mode |
Maximum Power Dissipation (mW) |
970/500 |
Rise Time (ns) |
3/2.2 |
Maximum Fall Time (ns) |
3/2.2 |
Maximum Output Current (mA) |
50 |
Minimum Operating Supply Voltage (V) |
3.135|4.75 |
Typical Operating Supply Voltage (V) |
3.3|5 |
Maximum Operating Supply Voltage (V) |
3.5|5.25 |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
70 |
Operating Supply Voltage (V) |
3.135 to 3.5|4.75 to 5.25 |
Maximum Storage Temperature (°C) |
100 |
Minimum Storage Temperature (°C) |
-40 |
|
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PACKAGE INFO
|
Supplier Package |
N/A |
Pin Count |
9 |
PCB |
9 |
Tab |
N/R |
Package Length (mm) |
25.4 |
Package Width (mm) |
12 |
Package Height (mm) |
24.8 |
Package Diameter (mm) |
N/R |
Mounting |
Through Hole |
Package Description |
N/A |
Package Family Name |
N/A |
Jedec |
N/A |
|
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MANUFACTURING INFO
|
MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
Ni |
Terminal Base Material |
Phosphor-Bronze |
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APPLICATIONS
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• Multimode fiber backbone links
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• Multimode fiber wiring closet to desktop links
|
• Very low cost multimode fiber links from wiring closet to
desktop |
• Multimode fiber media converters |
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