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• 8-Channel Complete Analog Front-End– LNA, VCAT, PGA, LPF, ADC
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• 40 dB Low Noise Voltage Controlled Attenuator (VCAT)
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• 24/30 dB Programmable Gain Amplifier (PGA)
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| • 3rd Order Linear Phase Low-Pass Filter (LPF)– 10, 15, 20, 30 MHz |
| • 14-bit Analog to Digital Converter (ADC)– 77 dBFS SNR at 65 MSPS– LVDS Outputs |
| • Noise/Power Optimizations (Full Chain)– 158 mW/CH at 0.75 nV/rtHz, 65 MSPS – 101 mW/CH at 1.1 nV/rtHz, 40 MSPS |
| • Excellent Device-to-Device Gain Matching – ±0.5 dB (Typical) and ±0.9 dB (Max) |
| • Low Harmonic Distortion |
| • Fast and Consistent Overload Recovery |
| • Small Package: 15 mm x 9 mm, 135-BGA |
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| CATALOG |
| AFE5803ZCF COUNTRY OF ORIGIN |
AFE5803ZCF PARAMETRIC INFO
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AFE5803ZCF PACKAGE INFO
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AFE5803ZCF MANUFACTURING INFO
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AFE5803ZCF PACKAGING INFO
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AFE5803ZCF EACD MODELS
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| AFE5803ZCF APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Philippines |
| Malaysia |
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PARAMETRIC INFO
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| Category |
General Purpose |
| type |
General Purpose |
| Number of ADCs |
8 |
| Sampling Rate (ksps) |
65000(Max) |
| Resolution (bit) |
14 |
| Number of Channels per Chip |
8 |
| Number of ADC Inputs |
8 |
| Interface Type |
Serial|LVDS |
| Maximum Input Voltage Range |
1Vp-p(Typ) |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Analog|Digital |
| Minimum Operating Supply Voltage (V) |
1.7|3.15|4.75 |
| Typical Operating Supply Voltage (V) |
1.8|3.3|5 |
| Maximum Operating Supply Voltage (V) |
1.9|3.6|5.5 |
| Typical Supply Current (mA) |
210 |
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PACKAGE INFO
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| Supplier packaging |
BGA |
| Basic package type |
Ball Grid Array |
| Number of pins |
135 |
| Pin shape |
Ball |
| PCB |
135 |
| ears |
N/R |
| Pin spacing (mm) |
1 |
| Package length (mm) |
9 |
| Package width (mm) |
15 |
| Package height (mm) |
1.26 |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
1.72(Max) |
| Install |
Surface Mount |
| Packaging materials |
Plastic |
| package instruction |
Ball Grid Array |
| Package series name |
BGA |
| Package outline |
Link to datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Plating materials |
not applicable |
| Terminal Base Material |
not applicable |
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PACKAGING INFO
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| Package |
Tray |
| Packing quantity |
160 |
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ECAD MODELS
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| APPLICATIONS |
| • Medical Ultrasound Imaging |
| • Nondestructive Evaluation Equipments |
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