AFT27S010NT1 NXP Semiconductors FET RF NCH 65V 2700MHZ PLD1.5W

label:
2025/08/19 14
AFT27S010NT1 NXP Semiconductors 	FET RF NCH 65V 2700MHZ PLD1.5W


CATALOG
AFT27S010NT1 COUNTRY OF ORIGIN
AFT27S010NT1 LIFECYCLE
AFT27S010NT1 PARAMETRIC INFO
AFT27S010NT1 PACKAGE INFO
AFT27S010NT1 MANUFACTURING INFO
AFT27S010NT1 PACKAGING INFO
AFT27S010NT1 ECAD MODELS


COUNTRY OF ORIGIN
Malaysia
United States of America


LIFECYCLE
Obsolete
Dec 15,2024


PARAMETRIC INFO
Channel Type N
Configuration Single
Maximum Drain-Source Voltage (V) 65
Maximum Frequency (MHz) 3600
Maximum Output Power (W) 1.26(Typ)
Maximum Duty Cycle (%) 10
Typical Power Gain @ Vds (dB) 21.7
Maximum VSWR 5
Typical Power 1dB Compression (dBm) 40
Minimum Frequency (MHz) 728
Mode of Operation 1-Carrier W-CDMA
Typical Drain Efficiency (%) 21.5
Maximum Gate-Source Leakage Current (nA) 1000
Maximum Gate Threshold Voltage (V) 1.6
Maximum IDSS (uA) 10
Number of Elements per Chip 1
Process Technology LDMOS
Types of Output Stages Single Ended
Typical Power Gain (dB) 21.7
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Channel Mode Enhancement
Maximum Gate-Source Voltage (V) 10
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package PLD-1.5W
Pin Count 3
PCB 3
Tab N/R
Package Length (mm) 6.73(Max)
Package Width (mm) 5.97(Max)
Package Height (mm) 1.83(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Material Plastic
Package Family Name PLD-1.5W
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 1000
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ