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• Dual Arm® Cortex®-A15 microprocessor subsystem
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• Up to 2.5MB of on-chip L3 RAM
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• 2x dual Arm® Cortex®-M4 co-processors (IPU1 and IPU2)
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• Up to four Embedded Vision Engines (EVEs)
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• 2x dual-core Programmable Real-Time Unit and Industrial Communication SubSystem (PRU-ICSS)
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• Video Processing Engine (VPE)
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| CATALOG |
AM5726BABCXA COUNTRY OF ORIGIN
|
AM5726BABCXA PARAMETRIC INFO
|
AM5726BABCXA PACKAGE INFO
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AM5726BABCXA MANUFACTURING INFO
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AM5726BABCXA PACKAGING INFO
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AM5726BABCXA ECAD MODELS
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AM5726BABCXA APPLICATIONS
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COUNTRY OF ORIGIN
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Korea (Republic of)
|
Philippines
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|
PARAMETRIC INFO
|
| Tradename |
Sitara™ |
| Family Name |
AM572x |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex A15 |
| Maximum Speed (MHz) |
1500 |
| Instruction Set Architecture |
RISC |
| Number of CPU Cores |
2 |
| Memory Card Interface |
MMC/SD/SDIO |
| Ethernet Interface Type |
MII/RGMII/RMII |
| Interface Type |
CAN/Ethernet/I2C/SPI/UART/USB |
| Ethernet Speed |
10Mbps/100Mbps |
| Multiply Accumulate |
No |
| CAN |
2 |
| Ethernet |
2 |
| I2C |
5 |
| I2S |
0 |
| SPI |
4 |
| UART |
10 |
| USART |
0 |
| USB |
2 |
| Core Architecture |
ARM |
| Programmability |
No |
| Minimum Operating Supply Voltage (V) |
1.71 |
| Typical Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
1.89 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Extended |
| Operating Supply Voltage (V) |
1.8 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
|
|
PACKAGE INFO
|
| Supplier Package |
FCBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
760 |
| Lead Shape |
Ball |
| PCB |
760 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
23.2(Max) |
| Package Width (mm) |
23.2(Max) |
| Package Height (mm) |
2.51(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
23.2(Max) |
| Package Overall Width (mm) |
23.2(Max) |
| Package Overall Height (mm) |
2.96(Max) |
| Seated Plane Height (mm) |
2.96(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Flip Chip Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/R |
| Terminal Base Material |
N/R |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
60 |
|
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ECAD MODELS
|
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| APPLICATIONS |
| • Industrial communication |
| • Human Machine Interface (HMI) |
| • Automation and control |
| • High performance applications |
| |
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