AMC1100DUBR Texas Instruments AMC1100 Fully-Differential Isolation Amplifier

label:
2024/03/14 298



• ±250-mV input voltage range optimized for shunt resistors
• Very low nonlinearity: 0.075% max at 5 V
• Low noise: 3.1 mVRMS typ
• Low high-side supply current:8 mA max at 5 V
• Input bandwidth: 60 kHz min
• Fixed gain: 8 (0.5% Accuracy)
• High common-mode rejection ratio: 108 dB
• Low-side operation: 3.3 V


CATALOG
AMC1100DUBR COUNTRY OF ORIGIN
AMC1100DUBR PARAMETRIC INFO
AMC1100DUBR PACKAGE INFO
AMC1100DUBR MANUFACTURING INFO
AMC1100DUBR PACKAGING INFO
AMC1100DUBR EACD MODELS
AMC1100DUBR APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
China
Thailand


PARAMETRIC INFO
type Differential Amplifier
Number of Elements per Chip 1
Number of Channels per Chip 1
Minimum PSRR (dB) 61(Typ)
Maximum Input Offset Voltage (mV) 0.2(Typ)@3.3V/5V
Minimum CMRR (dB) 95(Typ)
Minimum CMRR Range (dB) 95 to 105
Maximum Input Resistance (MOhm) 0.028(Typ)@3.3V/5V
Maximum Voltage Gain Range (dB) <35
Maximum Voltage Gain (dB) 8(Typ)
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Supplier Temperature Rating Extended Industrial
Power Supply Type Dual
Maximum Supply Voltage Range (V) 5 to 7
Minimum Dual Supply Voltage (V) 2.7|4.5
Typical Dual Supply Voltage (V) 5
Maximum Dual Supply Voltage (V) 5.5
Maximum Operating Supply Voltage (V) 5.5
Maximum Supply Current (mA) 8@5V/7@5.5V
Maximum Power Dissipation (mW) 44


PACKAGE INFO
Supplier packaging SOP
Basic package type Lead-Frame SMT
Number of pins 8
Pin shape Gull-wing
PCB 8
ears N/R
Pin spacing (mm) 2.54
Package length (mm) 9.55(Max)
Package width (mm) 6.67(Max)
Package height (mm) 3.35(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 9.55(Max)
Package Overall Width (mm) 10.7(Max)
Package Overall Height (mm) 4.85(Max)
Mounting surface height (mm) 4.85(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Plastic Small Outline Package
Package series name SO
JEDEC MS-001BA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) not applicable
Number of reflow cycles not applicable
standard not applicable
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Au
Plating materials Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Package Tape and reel packaging
Packing quantity 350
packaging type file Link to datasheet


ECAD MODELS



APPLICATIONS
• Electricity meters
• String inverters
• Power measurement applications
Продукт RFQ