
|
|
• VIN 4.7V to 23V
|
• 3A Continuous Output Current at 12Vin and 3.3Vout, 5.5A Peak
|
• VOUT Adjustable to 0.925 to 20V
|
• 340kHz Switching Frequency
|
• Programmable Soft-Start
|
• Enable Pin
|
• Protection
|
• OCP
|
• Thermal Shutdown
|
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
|
• Halogen and Antimony Free. “Green” Device (Note 3)
|
|
| CATALOG |
AP6503SP-13 COUNTRY OF ORIGIN
|
AP6503SP-13 LIFECYCLE
|
AP6503SP-13 PARAMETRIC INFO
|
AP6503SP-13 PACKAGE INFO
|
AP6503SP-13 MANUFACTURING INFO
|
AP6503SP-13 PACKAGING INFO
|
AP6503SP-13 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
LIFECYCLE
|
Obsolete
Jul 31,2023
|
|
PARAMETRIC INFO
|
| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
4.7 |
| Maximum Input Voltage (V) |
23 |
| Output Voltage (V) |
0.925 to 20 |
| Maximum Output Current (A) |
4 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Switching Frequency (kHz) |
380 |
| Efficiency (%) |
95 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
4.75 to 23 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
0.6 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SO EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.95(Max) |
| Package Width (mm) |
3.95(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline IC, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
MS-012 |
| Package Outline |
Link to Datasheet |
|
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
|
| PACKAGING INFO |
| Packaging Suffix |
13 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
| APPLICATIONS |
| • Gaming consoles |
| • Flat screen TV sets and monitors |
| • Set top boxes |
| • Distributed power systems |
| • Home audio |
| • Consumer electronics |
| • Network systems |
| • FPGA, DSP and ASIC supplies |
| • Green electronics |
| |