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• Precision Monitoring of +2.5V, +3V, +3.3V, and +5V
Power-Supply Voltages
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• Fully Specified Over Temperature
|
• Open-drain RESET Active Low
|
• Power-On/power supply glitch Reset Pulse
• APX803D 2ms (Typ)
• APX803 200ms (Typ)
|
• 30µA Supply Current (Typ.)
|
• Guaranteed Reset Valid to VCC = +1V
|
• No External Components
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• SOT23 and SOT23R: Available in “Green” Molding
Compound (No Br, Sb)
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• Lead Free Finish/ RoHS Compliant (Note 1)
|
|
| CATALOG |
APX803-26SAG-7 COUNTRY OF ORIGIN
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APX803-26SAG-7 PARAMETRIC INFO
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APX803-26SAG-7 PACKAGE INFO
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APX803-26SAG-7 MANUFACTURING INFO
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APX803-26SAG-7 PACKAGING INFO
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APX803-26SAG-7 ECAD MODELS
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APX803-26SAG-7 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Output Driver |
Active Low/Open Drain |
| Manual Reset |
No |
| Watchdog Timer |
No |
| Number of Supervisors |
1 |
| Typical Reset Threshold Voltage (V) |
2.63 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Chip Enable Signals |
No |
| Power Fail Detection |
No |
| Battery Backup Switching |
No |
| Maximum Reset Active Time (ms) |
200(Typ) |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Reset Threshold Voltage (V) |
2.59 |
| Maximum Reset Threshold Voltage (V) |
2.66 |
| Monitored Voltage (V) |
2.5|3|3.3|5 |
| Maximum Power Dissipation (mW) |
400 |
| Maximum Supply Current (uA) |
30(Typ) |
| Minimum Operating Supply Voltage (V) |
1.1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Type |
Voltage Supervisory |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.92 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.3 |
| Package Height (mm) |
0.98 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.4 |
| Package Overall Height (mm) |
1.03 |
| Seated Plane Height (mm) |
1.03 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Single Pin At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|
|
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APPLICATIONS
|
• Computers
|
| • Controllers |
| • Intelligent Instruments |
| • Critical µP and µC Power Monitoring |
• Portable/Battery Powered Equipment
|
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| |
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