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| CATALOG |
| AR1100T-I/MQ COUNTRY OF ORIGIN |
AR1100T-I/MQ PARAMETRIC INFO
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AR1100T-I/MQ PACKAGE INFO
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AR1100T-I/MQ MANUFACTURING INFO
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AR1100T-I/MQ PACKAGING INFO
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AR1100T-I/MQ EACD MODELS
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| COUNTRY OF ORIGIN |
| Thailand |
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PARAMETRIC INFO
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| Type |
Resistive |
| Resolution (bit) |
10 |
| Minimum Operating Supply Voltage (V) |
3.135 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Sensing Capacitance (nF) |
0.035 |
| Spread Spectrum |
No |
| Temperature Flag |
Opr |
| Touch Panel Interface |
4-Wire/5-Wire/8-Wire |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
No Lead |
| PCB |
20 |
| Tab |
N/R |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220 |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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ECAD MODELS
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