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• Access time : 55 ns
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• Low power consumption:Operating current : 30 mA (TYP.)Standby current : 4 µA (TYP.)
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• Single 2.7V ~ 5.5V power supply
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• All outputs TTL compatible
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• Fully static operation
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• Tri-state output
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• Data retention voltage :1.5V (MIN.)
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• All products ROHS Compliant
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• Package : 32-pin 450 mil SOP;32-pin 600 mil P-DIP 32-pin 8mm x 20mm TSOP-I 32-pin 8mm x 13.4mm STSOP 36-ball 6mm x 8mm TFBGA 32-pin 400 mil TSOP-II
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CATALOG |
AS6C4008-55SIN COUNTRY OF ORIGIN
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AS6C4008-55SIN PARAMETRIC INFO
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AS6C4008-55SIN PACKAGE INFO
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AS6C4008-55SIN MANUFACTURING INFO
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AS6C4008-55SIN PACKAGING INFO
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AS6C4008-55SIN ECAD MODELS
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AS6C4008-55SIN FUNCTIONAL BLOCK DIAGRAM
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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China
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PARAMETRIC INFO
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Density (bit) |
4M |
Timing Type |
Asynchronous |
Data Rate Architecture |
SDR |
Maximum Access Time (ns) |
55 |
Typical Operating Supply Voltage (V) |
3 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Density in Bits (bit) |
4194304 |
Number of Bits per Word (bit) |
8 |
Number of Ports |
1 |
Number of Words |
512K |
Maximum Operating Current (mA) |
60 |
Number of I/O Lines (bit) |
8 |
Address Bus Width (bit) |
19 |
Minimum Operating Supply Voltage (V) |
2.7 |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Process Technology |
CMOS |
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PACKAGE INFO
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Supplier Package |
SOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
32 |
Lead Shape |
Gull-wing |
PCB |
32 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
20.75(Max) |
Package Width (mm) |
11.3 |
Package Height (mm) |
2.82(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
3(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Plastic Small Outline Package |
Package Family Name |
SO |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 |
Number of Reflow Cycle |
N/A |
Standard |
N/A |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn|SnBi |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
72 |
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ECAD MODELS |

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FUNCTIONAL BLOCK DIAGRAM
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