AS6C4008-55SIN Alliance Memory IC SRAM 4M PARALLEL 32SOP

label:
2024/08/22 190
AS6C4008-55SIN Alliance Memory IC SRAM 4M PARALLEL 32SOP


• Access time : 55 ns
• Low power consumption:Operating current : 30 mA (TYP.)Standby current : 4 µA (TYP.)
• Single 2.7V ~ 5.5V power supply
• All outputs TTL compatible
• Fully static operation
• Tri-state output
• Data retention voltage :1.5V (MIN.)
• All products ROHS Compliant
• Package : 32-pin 450 mil SOP;32-pin 600 mil P-DIP 32-pin 8mm x 20mm TSOP-I 32-pin 8mm x 13.4mm STSOP 36-ball 6mm x 8mm TFBGA 32-pin 400 mil TSOP-II


CATALOG
AS6C4008-55SIN COUNTRY OF ORIGIN
AS6C4008-55SIN PARAMETRIC INFO
AS6C4008-55SIN PACKAGE INFO
AS6C4008-55SIN MANUFACTURING INFO
AS6C4008-55SIN PACKAGING INFO
AS6C4008-55SIN ECAD MODELS
AS6C4008-55SIN FUNCTIONAL BLOCK DIAGRAM


COUNTRY OF ORIGIN
Taiwan (Province of China)
China


PARAMETRIC INFO
Density (bit) 4M
Timing Type Asynchronous
Data Rate Architecture SDR
Maximum Access Time (ns) 55
Typical Operating Supply Voltage (V) 3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Density in Bits (bit) 4194304
Number of Bits per Word (bit) 8
Number of Ports 1
Number of Words 512K
Maximum Operating Current (mA) 60
Number of I/O Lines (bit) 8
Address Bus Width (bit) 19
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 5.5
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Process Technology CMOS


PACKAGE INFO
Supplier Package SOP
Basic Package Type Lead-Frame SMT
Pin Count 32
Lead Shape Gull-wing
PCB 32
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 20.75(Max)
Package Width (mm) 11.3
Package Height (mm) 2.82(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 3(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Small Outline Package
Package Family Name SO
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20
Number of Reflow Cycle N/A
Standard N/A
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn|SnBi
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 72


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM


Продукт RFQ