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• Access time : 55 ns
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• Low power consumption:Operating current : 30 mA (TYP.)Standby current : 4 µA (TYP.)
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• Single 2.7V ~ 5.5V power supply
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• All outputs TTL compatible
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• Fully static operation
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• Tri-state output
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• Data retention voltage :1.5V (MIN.)
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• All products ROHS Compliant
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• Package : 32-pin 450 mil SOP;32-pin 600 mil P-DIP 32-pin 8mm x 20mm TSOP-I 32-pin 8mm x 13.4mm STSOP 36-ball 6mm x 8mm TFBGA 32-pin 400 mil TSOP-II
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| CATALOG |
AS6C4008-55SIN COUNTRY OF ORIGIN
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AS6C4008-55SIN PARAMETRIC INFO
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AS6C4008-55SIN PACKAGE INFO
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AS6C4008-55SIN MANUFACTURING INFO
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AS6C4008-55SIN PACKAGING INFO
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AS6C4008-55SIN ECAD MODELS
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AS6C4008-55SIN FUNCTIONAL BLOCK DIAGRAM
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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China
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PARAMETRIC INFO
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| Density (bit) |
4M |
| Timing Type |
Asynchronous |
| Data Rate Architecture |
SDR |
| Maximum Access Time (ns) |
55 |
| Typical Operating Supply Voltage (V) |
3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Density in Bits (bit) |
4194304 |
| Number of Bits per Word (bit) |
8 |
| Number of Ports |
1 |
| Number of Words |
512K |
| Maximum Operating Current (mA) |
60 |
| Number of I/O Lines (bit) |
8 |
| Address Bus Width (bit) |
19 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Process Technology |
CMOS |
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PACKAGE INFO
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| Supplier Package |
SOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
Gull-wing |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
20.75(Max) |
| Package Width (mm) |
11.3 |
| Package Height (mm) |
2.82(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
3(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Plastic Small Outline Package |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|SnBi |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
72 |
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| ECAD MODELS |

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FUNCTIONAL BLOCK DIAGRAM
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