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• Standard PLCC-4 package (Plastic Leaded Chip Carrier
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• LED package with diffused silicone encapsulation
|
• Using AlInGaP and InGaN dice technologies
|
• Typical viewing angle at 115°
|
• Compatible with reflow soldering process
|
• JEDEC MSL 3
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|
| CATALOG |
ASMB-MTB0-0A3A2 COUNTRY OF ORIGIN
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| ASMB-MTB0-0A3A2 LIFECYCLE |
ASMB-MTB0-0A3A2 PARAMETRIC INFO
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ASMB-MTB0-0A3A2 PACKAGE INFO
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ASMB-MTB0-0A3A2 MANUFACTURING INFO
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ASMB-MTB0-0A3A2 PACKAGING INFO
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ASMB-MTB0-0A3A2 ECAD MODELS
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ASMB-MTB0-0A3A2 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
|
| LIFECYCLE |
Obsolete
Jun 18,2021 |
|
PARAMETRIC INFO
|
| Type |
Tri-Color |
| Color |
Blue/Green/Red |
| Category |
Chip LED |
| Mounting Orientation |
Top Mount |
| Lens Shape Type |
Circular |
| Lead Standoff |
No |
| High Brightness |
Yes |
| Peak Wavelength (nm) |
465/522/634 |
| Dominant Wavelength (nm) |
470/530/625 |
| Intensity |
350mcd|1600mcd|540mcd |
| Supplier Color |
Blue/Green/Red |
| Test Current (mA) |
20 |
| Number of LEDs |
3 |
| Viewing Angle (°) |
115 |
| Lens Appearance |
Diffused |
| High Power |
No |
| Maximum Forward Voltage (V) |
3.6/3.6/2.6 |
| Maximum Forward Current (mA) |
25 |
| Reverse Voltage (V) |
4(Min) |
| Maximum Power Dissipation (mW) |
90/90/65 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
100 |
| Peak Wavelength Range (nm) |
< 500|500 to 600|600 to 700 |
| Maximum Forward Voltage Range (V) |
1.8 to 3.3|3.3 to 5 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
100 |
|
|
PACKAGE INFO
|
| Supplier Package |
PLCC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
4 |
| Lead Shape |
J-Lead |
| PCB |
4 |
| Tab |
N/R |
| Package Length (mm) |
2.8 |
| Package Width (mm) |
3.2 |
| Package Height (mm) |
N/A |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.9 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Plastic Leaded Chip Carrier |
| Package Family Name |
LCC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
255 to 260 |
| Reflow Solder Time (Sec) |
10 to 30 |
| Number of Reflow Cycle |
2 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Ag |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
|
|
ECAD MODELS
|
 |
|
| APPLICATIONS |
| • Indoor full color display |
| |
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