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• Low-Voltage Operation:– VCC = 1.7V to 5.5V
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• Internally Organized as 512 x 8 (4K) or 1,024 x 8 (8K)
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• Industrial Temperature Range: -40°C to +85°C
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• I2C-Compatible (Two-Wire) Serial Interface:– 100 kHz Standard mode, 1.7V to 5.5V– 400 kHz Fast mode, 1.7V to 5.5V– 1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V
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• Schmitt Triggers, Filtered Inputs for Noise Suppression
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• Bidirectional Data Transfer Protocol
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• Write-Protect Pin for Full Array Hardware Data Protection
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• Ultra Low Active Current (3 mA maximum) and Standby Current (6 μA maximum)
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| CATALOG |
AT24C08C-STUM-T COUNTRY OF ORIGIN
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AT24C08C-STUM-T PARAMETRIC INFO
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AT24C08C-STUM-T PACKAGE INFO
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AT24C08C-STUM-T MANUFACTURING INFO
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AT24C08C-STUM-T PACKAGING INFO
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AT24C08C-STUM-T ECAD MODELS
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COUNTRY OF ORIGIN
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Thailand
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PARAMETRIC INFO
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| Density (bit) |
8K |
| Interface Type |
Serial-I2C |
| Maximum Operating Frequency (MHz) |
1 |
| Maximum Access Time (ns) |
450 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| Density in Bits (bit) |
8192 |
| Maximum Supply Current (mA) |
3 |
| Hardware Data Protection |
Yes |
| Organization |
1Kx8 |
| Data Retention (Year) |
100(Min) |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Number of Bits per Word (bit) |
8 |
| Address Bus Width (bit) |
8 |
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PACKAGE INFO
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| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
-T |
| Packaging |
Tape and Reel |
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ECAD MODELS
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