 |
|
• Low-Voltage Operation:
– VCC = 1.7V to 5.5V |
| • Internally Organized as 16,384 x 8 (128K)
|
| • Industrial Temperature Range: -40°C to +85°C |
• I2C-Compatible (Two-Wire) Serial Interface:
– 100 kHz Standard mode, 1.7V to 5.5V
– 400 kHz Fast mode, 1.7V to 5.5V
– 1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V |
| • Schmitt Triggers, Filtered Inputs for Noise Suppression |
| • Bidirectional Data Transfer Protocol |
| • Write-Protect Pin for Full Array Hardware Data Protection |
| • Ultra Low Active Current (3 mA maximum) and Standby Current (6 μA maximum)
|
• 64-Byte Page Write Mode:
– Partial page writes allowed |
| • Random and Sequential Read Modes |
| • Self-Timed Write Cycle within 5 ms Maximum |
• High Reliability:
– Endurance: 1,000,000 write cycles
– Data retention: 100 years |
| • Green Package Options (Lead-free/Halide-free/RoHS compliant)‑
|
| • Die Sale Options: Wafer Form and Bumped Wafers |
|
| CATALOG |
| AT24C128C-MAHM-T COUNTRY OF ORIGIN |
| AT24C128C-MAHM-T PARAMETRIC INFO |
| AT24C128C-MAHM-T PACKAGE INFO |
| AT24C128C-MAHM-T MANUFACTURING INFO |
| AT24C128C-MAHM-T PACKAGING INFO |
| AT24C128C-MAHM-T ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Philippines |
| Thailand |
|
| PARAMETRIC INFO |
| Density (bit) |
128K |
| Interface Type |
Serial-I2C |
| Maximum Operating Frequency (MHz) |
1 |
| Maximum Access Time (ns) |
550 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| Density in Bits (bit) |
131072 |
| Maximum Operating Current (mA) |
3 |
| Hardware Data Protection |
Yes |
| Organization |
16Kx8 |
| Data Retention (Year) |
40 |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Number of Bits per Word (bit) |
8 |
| Maximum Storage Temperature (°C) |
150 |
| Address Bus Width (bit) |
3 |
|
|
| PACKAGE INFO |
| Supplier Package |
UDFN |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
2 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.55(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2 |
| Package Overall Width (mm) |
3 |
| Package Overall Height (mm) |
0.55 |
| Seated Plane Height (mm) |
0.55 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Dual Flat Package No Lead |
| Package Family Name |
DFN |
| Jedec |
N/A |
|
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
8.4|12.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8|12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
| ECAD MODELS |
 |
| |
|
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