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• Serial Peripheral Interface (SPI) Compatible
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• Supports SPI Modes 0 (0,0) and 3 (1,1)-Data Sheet Describes Mode 0 Operation
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• Low-voltage and Standard-voltage Operation-VCC = 1.8V to 5.5V
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| • 20MHz Clock Rate (5V) |
| • 8-byte Page Mode |
| • Block Write Protection-Protect 1/4, 1/2, or Entire Array |
| • Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software Data Protection |
| • Self-timed Write Cycle (5ms max) |
| • High Reliability - Endurance: 1,000,000 Write Cycles- Data Retention: 100 Years |
| • Green (Pb/Halogen-free/RoHS Compliant) Packaging Options |
| • Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers |
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| CATALOG |
| AT25020B-SSHL-T COUNTRY OF ORIGIN |
AT25020B-SSHL-T PARAMETRIC INFO
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AT25020B-SSHL-T PACKAGE INFO
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AT25020B-SSHL-T MANUFACTURING INFO
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AT25020B-SSHL-T PACKAGING INFO
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AT25020B-SSHL-T EACD MODELS
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| COUNTRY OF ORIGIN |
| China |
| Philippines |
| Taiwan (Province of China) |
| Malaysia |
| Thailand |
| Singapore |
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PARAMETRIC INFO
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| Density (bit) |
2K |
| Interface Type |
Serial-SPI |
| Maximum Operating Frequency (MHz) |
20 |
| Maximum Access Time (ns) |
20 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| Maximum Cycle Time (s) |
5m |
| I/O Mode |
Serial |
| Density in Bits (bit) |
2048 |
| Maximum Operating Current (mA) |
10 |
| Hardware Data Protection |
Yes |
| Organization |
256x8 |
| Data Retention (Year) |
100 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Number of Bits per Word (bit) |
8 |
| Address Bus Width (bit) |
8 |
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PACKAGE INFO
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| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
4.98(Max) |
| Package Width (mm) |
3.99(Max) |
| Package Height (mm) |
1.48(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4.98(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.73(Max) |
| Seated Plane Height (mm) |
1.73(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
4000 |
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ECAD MODELS
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