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• Fast read access time – 90ns
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• Low-power CMOS operation
– 100µA max standby
– 40mA max active at 5MHz
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• JEDEC standard packages
– 32-lead PLCC
– 32-lead PDIP
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• 5V 10% supply |
• High-reliability CMOS technology
– 2,000V ESD protection
– 200mA latchup immunity |
• Rapid programming algorithm – 50µs/byte (typical) |
• CMOS- and TTL-compatible inputs and outputs |
• Integrated product identification code |
• Industrial temperature range |
• Green (Pb/halide-free) packaging option |
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CATALOG |
AT27C080-90PU COUNTRY OF ORIGIN |
AT27C080-90PU PARAMETRIC INFO
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AT27C080-90PU PACKAGE INFO
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AT27C080-90PU MANUFACTURING INFO
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AT27C080-90PU PACKAGING INFO
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AT27C080-90PU ECAD MODELS
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COUNTRY OF ORIGIN |
Taiwan (Province of China) |
Philippines |
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PARAMETRIC INFO
|
Density (bit) |
8M |
Interface Type |
Parallel |
Maximum Access Time (ns) |
90 |
Typical Operating Supply Voltage (V) |
5 |
Reprogramming Technique |
OTP |
In-System Programmability |
External |
Minimum Operating Temperature (°C) |
-40 |
Programmability |
Yes |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Density in Bits (bit) |
8388608 |
Maximum Operating Current (mA) |
40 |
Programming Voltage (V) |
13 |
Organization |
1Mx8 |
Output Enable Access Time (ns) |
20 |
Minimum Operating Supply Voltage (V) |
4.5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Operating Supply Voltage (V) |
5 |
|
|
PACKAGE INFO
|
Supplier Package |
PDIP W |
Basic Package Type |
Through Hole |
Pin Count |
32 |
Lead Shape |
Through Hole |
PCB |
32 |
Tab |
N/R |
Package Length (mm) |
42.29(Max) |
Package Width (mm) |
13.97(Max) |
Package Height (mm) |
4.83(Max) - 0.38(Min) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
4.83(Max) |
Mounting |
Through Hole |
Package Material |
Plastic |
Package Description |
Plastic Dual In Line Package |
Package Family Name |
DIP |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
245 |
Reflow Solder Time (Sec) |
N/A |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
N/A |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
|
Packaging |
Tube |
Quantity Of Packaging |
12 |
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ECAD MODELS
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