AT27C080-90PU Microchip Technology IC EPROM 8M PARALLEL 32DIP

label:
2024/01/17 353



• Fast read access time – 90ns
• Low-power CMOS operation – 100µA max standby – 40mA max active at 5MHz
• JEDEC standard packages – 32-lead PLCC – 32-lead PDIP
• 5V 10% supply
• High-reliability CMOS technology – 2,000V ESD protection – 200mA latchup immunity
• Rapid programming algorithm – 50µs/byte (typical)
• CMOS- and TTL-compatible inputs and outputs
• Integrated product identification code
• Industrial temperature range
• Green (Pb/halide-free) packaging option


CATALOG
AT27C080-90PU COUNTRY OF ORIGIN
AT27C080-90PU PARAMETRIC INFO
AT27C080-90PU PACKAGE INFO
AT27C080-90PU MANUFACTURING INFO
AT27C080-90PU PACKAGING INFO
AT27C080-90PU ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Philippines


PARAMETRIC INFO
Density (bit) 8M
Interface Type Parallel
Maximum Access Time (ns) 90
Typical Operating Supply Voltage (V) 5
Reprogramming Technique OTP
In-System Programmability External
Minimum Operating Temperature (°C) -40
Programmability Yes
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Density in Bits (bit) 8388608
Maximum Operating Current (mA) 40
Programming Voltage (V) 13
Organization 1Mx8
Output Enable Access Time (ns) 20
Minimum Operating Supply Voltage (V) 4.5
Maximum Operating Supply Voltage (V) 5.5
Operating Supply Voltage (V) 5


PACKAGE INFO
Supplier Package PDIP W
Basic Package Type Through Hole
Pin Count 32
Lead Shape Through Hole
PCB 32
Tab N/R
Package Length (mm) 42.29(Max)
Package Width (mm) 13.97(Max)
Package Height (mm) 4.83(Max) - 0.38(Min)
Package Diameter (mm) N/R
Seated Plane Height (mm) 4.83(Max)
Mounting Through Hole
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 245
Reflow Solder Time (Sec) N/A
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 12


ECAD MODELS


Продукт RFQ