AT27C512R-70PU Microchip Technology IC EPROM 512K PARALLEL 28DIP

label:
2023/09/7 430



CATALOG
AT27C512R-70PU COUNTRY OF ORIGIN
AT27C512R-70PU PARAMETRIC INFO
AT27C512R-70PU PACKAGE INFO
AT27C512R-70PU MANUFACTURING INFO
AT27C512R-70PU PACKAGING INFO
AT27C512R-70PU ECAD MODELS


COUNTRY OF ORIGIN
Thailand
Philippines
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 512K
Interface Type Parallel
Maximum Access Time (ns) 70
Typical Operating Supply Voltage (V) 5
Reprogramming Technique OTP
In-System Programmability External
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Programmability Yes
Supplier Temperature Grade Industrial
Density in Bits (bit) 524288
Maximum Operating Current (mA) 20
Programming Voltage (V) 12.75 to 13.25
Organization 64Kx8
Output Enable Access Time (ns) 30
Minimum Operating Supply Voltage (V) 4.5
Maximum Operating Supply Voltage (V) 5.5
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Operating Supply Voltage (V) 5
Process Technology CMOS


PACKAGE INFO
Supplier Package PDIP W
Basic Package Type Through Hole
Pin Count 28
Lead Shape Through Hole
PCB 28
Tab N/R
Pin Pitch (mm) 2.79(Max)
Package Length (mm) 37.3(Max)
Package Width (mm) 14.4(Max)
Package Height (mm) 3.94(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 5.59(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Dual In Line Package Wide Body
Package Family Name DIP
Jedec N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Number of Reflow Cycle N/R
Standard N/R
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/A


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 14
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ