AT45DB041E-SSHN-T Renesas / Dialog IC FLASH 4M SPI 85MHZ 8SOIC

label:
2024/01/31 413



CATALOG
AT45DB041E-SSHN-T COUNTRY OF ORIGIN
AT45DB041E-SSHN-T PARAMETRIC INFO
AT45DB041E-SSHN-T PACKAGE INFO
AT45DB041E-SSHN-T MANUFACTURING INFO
AT45DB041E-SSHN-T PACKAGING INFO


COUNTRY OF ORIGIN
Philippines
Malaysia
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 4M
Cell Type NOR
Interface Type Serial-SPI
Block Organization Symmetrical
Boot Block No
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 7
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Programmability Yes
I/O Mode Serial
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 8
Number of Words 512K
Maximum Operating Current (mA) 15
Programming Voltage (V) 1.65 to 3.6
Maximum Operating Frequency (MHz) 85
Sector Size 64Kbyte x 8
Program Current (mA) 16
Address Bus Width (bit) 19
Minimum Operating Supply Voltage (V) 1.65
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 17/Chip
Maximum Programming Time (ms) 3/Page
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode Yes
Page Size 264byte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 4194304


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5.05(Max)
Package Width (mm) 3.99(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5.05(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 4000
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet

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