AT89C51ED2-SLSUM Microchip Technology IC MCU 8BIT 64KB FLASH 44PLCC

label:
2024/02/18 396



CATALOG
AT89C51ED2-SLSUM COUNTRY OF ORIGIN
AT89C51ED2-SLSUM PARAMETRIC INFO
AT89C51ED2-SLSUM PACKAGE INFO
AT89C51ED2-SLSUM MANUFACTURING INFO
AT89C51ED2-SLSUM ECAD MODELS


COUNTRY OF ORIGIN
Malaysia
Thailand


PARAMETRIC INFO
Data Bus Width (bit) 8
Series name AT89
Device Core 8051
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 60
Program Memory Type Flash
Program Memory Size 64KB
RAM Size 2KB
Maximum Expanded Memory Size 64KB
Maximum CPU Frequency (MHz) 60
EEPROM 2KB
Direct Memory Access no
Floating Point Unit no
Bluetooth no
Wi-Fi no
Multiply Accumulate no
Internal/External Clock Type Internal/External
Touch Sensing Interface no
Power On Reset yes
Memory Protection Unit no
Temperature Sensor no
DDR no
Memory Management Unit no
Integrated Development Environment no
Super Scalar no
External Bus Interface no
Number of Programmable I/Os 32
Number of Timers 3
Core Architecture 8051
PWM 5
Watchdog 1
Parallel Master Port no
Real Time Clock no
Special Features Programmable Counter Array
Interface Type SPI/UART
Timers Resolution (bit) 16/16/16
Programmability yes
SPI 1
I2C 0
I2S 0
Process Technology CMOS
UART 1
USART 0
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging PLCC
Basic package type Lead-Frame SMT
Number of pins 44
Pin shape J-Lead
PCB 44
ears N/R
Pin spacing (mm) 1.27
Package length (mm) 16.7(Max)
Package width (mm) 16.7(Max)
Package height (mm) 3.48(Max)
Package diameter (mm) N/R
Mounting surface height (mm) 4.57(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Plastic Leaded Chip Carrier
Package series name LCC
JEDEC MS-018AC
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1|3
Maximum reflow temperature (°C) 245
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


ECAD MODELS


Продукт RFQ