AT89C51RD2-SLSUM Microchip Technology IC MCU 8BIT 64KB FLASH 44PLCC

label:
2024/05/5 259


CATALOG
AT89C51RD2-SLSUM COUNTRY OF ORIGIN
AT89C51RD2-SLSUM PARAMETRIC INFO
AT89C51RD2-SLSUM PACKAGE INFO
AT89C51RD2-SLSUM MANUFACTURING INFO
AT89C51RD2-SLSUM PACKAGING INFO
AT89C51RD2-SLSUM EACD MODELS


 
COUNTRY OF ORIGIN
China


 
PARAMETRIC INFO
Family Name AT89
Data Bus Width (bit) 8
Device Core 80C51
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 60
Program Memory Type Flash
Program Memory Size 64KB
RAM Size 2KB
Maximum Expanded Memory Size 64KB
Maximum CPU Frequency (MHz) 60
EEPROM 2KB
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset Yes
Memory Protection Unit No
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Number of Programmable I/Os 32
Number of Timers 3
Core Architecture 8051
PWM 5
Watchdog 1
Parallel Master Port No
Real Time Clock No
Special Features Programmable Counter Array
Interface Type SPI/UART
Timers Resolution (bit) 16/16/16
Programmability Yes
SPI 1
I2C 0
I2S 0
Process Technology CMOS
UART 1
USART 0
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


 
PACKAGE INFO
Supplier Package PLCC
Basic Package Type Lead-Frame SMT
Pin Count 44
Lead Shape J-Lead
PCB 44
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 16.7(Max)
Package Width (mm) 16.7(Max)
Package Height (mm) 3.48(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 4.57(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Leaded Chip Carrier
Package Family Name LCC
Jedec MS-018AC
Package Outline Link to Datasheet


 
MANUFACTURING INFO
MSL 1|3
Maximum Reflow Temperature (°C) 245
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 27


 
ECAD MODELS




Продукт RFQ