
|
|
• Compatible with MCS®-51 Products
|
• 8K Bytes of In-System Programmable (ISP) Flash Memory– Endurance: 10,000 Write/Erase Cycles
|
• 4.0V to 5.5V Operating Range
|
• Fully Static Operation: 0 Hz to 33 MHz |
• Three-level Program Memory Lock |
• 256 x 8-bit Internal RAM |
• 32 Programmable I/O Lines |
• Three 16-bit Timer/Counters |
• Eight Interrupt Sources |
• Full Duplex UART Serial Channel |
• Low-power Idle and Power-down Modes |
• Interrupt Recovery from Power-down Mode |
• Watchdog Timer |
• Dual Data Pointer |
• Power-off Flag |
• Fast Programming Time |
• Flexible ISP Programming (Byte and Page Mode) |
• Green (Pb/Halide-free) Packaging Option |
|
CATALOG |
AT89S52-24AU COUNTRY OF ORIGIN |
AT89S52-24AU PARAMETRIC INFO
|
AT89S52-24AU PACKAGE INFO
|
AT89S52-24AU MANUFACTURING INFO
|
AT89S52-24AU PACKAGING INFO
|
AT89S52-24AU EACD MODELS
|
AT89S52-24AU APPLICATIONS |
|
COUNTRY OF ORIGIN |
Philippines |
Taiwan (Province of China) |
Thailand |
China |
Singapore |
|
PARAMETRIC INFO
|
Family Name |
AT89 |
Data Bus Width (bit) |
8 |
Device Core |
8051 |
Instruction Set Architecture |
CISC |
Maximum Clock Rate (MHz) |
24 |
Program Memory Type |
Flash |
Program Memory Size |
8KB |
RAM Size |
256B |
Maximum Expanded Memory Size |
64KB |
Maximum CPU Frequency (MHz) |
24 |
Direct Memory Access |
No |
Floating Point Unit |
No |
Bluetooth |
No |
Wi-Fi |
No |
Multiply Accumulate |
No |
Internal/External Clock Type |
Internal/External |
Touch Sensing Interface |
No |
Power On Reset |
No |
Memory Protection Unit |
No |
Temperature Sensor |
No |
DDR |
No |
Memory Management Unit |
No |
Integrated Development Environment |
No |
Super Scalar |
No |
External Bus Interface |
No |
Number of Programmable I/Os |
32 |
Number of Timers |
3 |
Core Architecture |
8051 |
Watchdog |
1 |
Parallel Master Port |
No |
Real Time Clock |
No |
Interface Type |
UART |
Programmability |
Yes |
SPI |
0 |
I2C |
0 |
I2S |
0 |
Process Technology |
CMOS |
UART |
1 |
USART |
0 |
CAN |
0 |
USB |
0 |
Ethernet |
0 |
Minimum Operating Supply Voltage (V) |
4 |
Typical Operating Supply Voltage (V) |
5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Temperature Flag |
Opr |
Supplier Temperature Grade |
Industrial |
Operating Supply Voltage (V) |
5 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
Supplier Package |
TQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
44 |
Lead Shape |
Gull-wing |
PCB |
44 |
Tab |
N/R |
Pin Pitch (mm) |
0.8 |
Package Length (mm) |
10 |
Package Width (mm) |
10 |
Package Height (mm) |
1 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
12 |
Package Overall Width (mm) |
12 |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Thin Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026ACB |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
Packaging |
Tray |
Quantity Of Packaging |
160 |
|
|
ECAD MODELS
|

|
|