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|
• Low-Voltage Operation:
– VCC = 1.7V to 5.5V
|
• User-Selectable Internal Organization:
– 2K: 256 x 8 or 128 x 16
– 4K: 512 x 8 or 256 x 16
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• Industrial Temperature Range: -40°C to +85°C
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• Three-Wire Serial Interface
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• Sequential Read Operation
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| • 2 MHz Clock Rate (5V) |
| • Self-Timed Write Cycle within 5 ms Maximum |
| • High Reliability:
– Endurance: 1,000,000 write cycles
– Data retention: 100 years |
| • Green Package Options (Lead-free/Halide-free/RoHS compliant) |
| • Die Sale Options: Wafer Form
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|
| CATALOG |
AT93C66B-XHM-T COUNTRY OF ORIGIN
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AT93C66B-XHM-T PARAMETRIC INFO
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AT93C66B-XHM-T PACKAGE INFO
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AT93C66B-XHM-T MANUFACTURING INFO
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AT93C66B-XHM-T PACKAGING INFO
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AT93C66B-XHM-T ECAD MODELS
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|
COUNTRY OF ORIGIN
|
Philippines
|
| Taiwan (Province of China) |
| China |
| Singapore |
| Thailand |
| Malaysia |
|
PARAMETRIC INFO
|
| Density (bit) |
4K |
| Interface Type |
Serial-3Wire |
| Maximum Operating Frequency (MHz) |
0.25 |
| Maximum Access Time (ns) |
1000 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Programmability |
Yes |
| Density in Bits (bit) |
4096 |
| Maximum Operating Current (mA) |
2 |
| Hardware Data Protection |
Yes |
| Organization |
512x8|256x16 |
| Data Retention (Year) |
100 |
| Minimum Operating Supply Voltage (V) |
1.7 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Number of Bits per Word (bit) |
8|16 |
| Maximum Storage Temperature (°C) |
150 |
| Address Bus Width (bit) |
9|8 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
|
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ECAD MODELS
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