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• Reference voltage tolerance at 25°C– 0.5% (B Grade)– 1% (A Grade)
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• Minimum typical output voltage: 2.5 V
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• Adjustable output voltage: Vref to 36 V
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• Operation from −40°C to +125°C (Q temp)
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• Maximum temperature drift– 17 mV (I Temp)– 27 mV (Q Temp)
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• 0.3-Ω Typical output impedance
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• Sink-current capability– Imin = 0.08 mA (max)– IKA = 15 mA (max)
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• Reference input current IREF: 0.4 μA (max)
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• Deviation of reference input current over temperature, II(dev): 0.3 μA (max)
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• Packages: 1-mm x 1-mm X2SON or SOT23-3
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| CATALOG |
ATL431LIBQDBZR COUNTRY OF ORIGIN
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ATL431LIBQDBZR PARAMETRIC INFO
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ATL431LIBQDBZR PACKAGE INFO
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ATL431LIBQDBZR MANUFACTURING INFO
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ATL431LIBQDBZR PACKAGING INFO
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ATL431LIBQDBZR ECAD MODELS
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ATL431LIBQDBZR APPLICATIONS
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COUNTRY OF ORIGIN
|
Philippines
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China
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PARAMETRIC INFO
|
| Topology |
Shunt |
| Reference Type |
Adjustable |
| Output Voltage (V) |
2.5 to 36 |
| Initial Accuracy |
0.5% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Input Voltage (V) |
37 |
| Maximum Output Current (mA) |
15 |
| Maximum Temperature Coefficient |
66ppm/°C |
|
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PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.04(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
0.95 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.04(Max) |
| Package Overall Width (mm) |
2.64(Max) |
| Package Overall Height (mm) |
1.12(Max) |
| Seated Plane Height (mm) |
1.12(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236 |
| Package Outline |
Link to Datasheet |
|
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
N/A|Cu Alloy |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9|9.2 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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| APPLICATIONS |
• Adjustable voltage and current referencing
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• Secondary side regulation in Flyback SMPS
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• Zener diode replacement
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| • Voltage monitoring |
| • Precision constant current sink/source |
| • Comparator with integrated reference |
| |
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