ATmega168-20AU Microchip Technology IC MCU 8BIT 16KB FLASH 32TQFP

label:
2024/04/3 217


CATALOG
ATmega168-20AU COUNTRY OF ORIGIN
ATmega168-20AU PARAMETRIC INFO
ATmega168-20AU PACKAGE INFO
ATmega168-20AU MANUFACTURING INFO
ATmega168-20AU PACKAGING INFO
ATmega168-20AU EACD MODELS


COUNTRY OF ORIGIN
China
Philippines
Korea (Republic of)
Thailand
Taiwan (Province of China)
Singapore



PARAMETRIC INFO
Data Bus Width (bit) 8
Series name ATmega
Device Core AVR
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 16KB
RAM Size 1KB
Maximum CPU Frequency (MHz) 20
Maximum Dhrystone MIPS (MIPS) 1
EEPROM 512B
Direct Memory Access no
Floating Point Unit no
Bluetooth no
Wi-Fi no
Multiply Accumulate no
Input Capture Channels 1
Output Compare Channels 3
Internal/External Clock Type Internal/External
Touch Sensing Interface no
Power On Reset no
Memory Protection Unit no
Temperature Sensor yes
DDR no
Memory Management Unit no
Integrated Development Environment no
Super Scalar no
External Bus Interface no
Number of Programmable I/Os twenty three
Number of Timers 3
ADC Channels 8
ADC Resolution (bit) 10
Number of ADCs Single
Core Architecture AVR
PWM 6
Watchdog 1
Analog Comparators 1
Parallel Master Port no
Real Time Clock no
Interface Type I2C/SPI/USART
Programmability yes
SPI 2
I2C 1
I2S 0
Process Technology CMOS
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging TQFP
Basic package type Lead-Frame SMT
Number of pins 32
Pin shape Gull-wing
PCB 32
ears N/R
Pin spacing (mm) 0.8
Package length (mm) 7
Package width (mm) 7
Package height (mm) 1.05(Max)
Package diameter (mm) N/R
Mounting surface height (mm) 1.2(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Thin Quad Flat Package
Package series name QFP
JEDEC MS-026ABA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Package Tray
Packing quantity 250


ECAD MODELS



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