ATmega88PA-AUR Microchip Technology IC MCU 8BIT 8KB FLASH 32TQFP

label:
2024/05/9 258

• High Performance, Low Power AVR® 8-Bit Microcontroller Family
• Advanced RISC Architecture 131 Powerful Instructions – Most Single Clock Cycle Execution 32 x 8 General Purpose Working Registers Fully Static Operation Up to 20 MIPS Throughput at 20MHz On-chip 2-cycle Multiplier
• QTouch® library support Capacitive touch buttons, sliders and wheels QTouch and QMatrix™ acquisition Up to 64 sense channels

• Special Microcontroller Features Power-on Reset and Programmable Brown-out Detection Internal Calibrated Oscillator External and Internal Interrupt Sources Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby, and Extended Standby
CATALOG
ATmega88PA-AUR COUNTRY OF ORIGIN
ATmega88PA-AUR PARAMETRIC INFO
ATmega88PA-AUR PACKAGE INFO
ATmega88PA-AUR MANUFACTURING INFO
ATmega88PA-AUR PACKAGING INFO
ATmega88PA-AUR EACD MODELS


 
COUNTRY OF ORIGIN
Taiwan (Province of China)
Philippines
Thailand
Korea (Republic of)


 
PARAMETRIC INFO
Family Name ATmega
Data Bus Width (bit) 8
Device Core AVR
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 8KB
RAM Size 1KB
Maximum CPU Frequency (MHz) 20
Number of Programmable I/Os 23
Number of Timers 3
ADC Channels 8
ADC Resolution (bit) 10
Core Architecture AVR
Number of ADCs Single
PWM 6
Watchdog 1
Analog Comparators 1
Interface Type I2C/SPI/TWI/USART
Programmability Yes
SPI 2
I2C 1
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2.5|3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


 
PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 32
Lead Shape Gull-wing
PCB 32
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 7
Package Width (mm) 7
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Quad Flat Package
Package Family Name QFP
Jedec MS-026ABA
Package Outline Link to Datasheet


 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


 
PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000


 
ECAD MODELS


Продукт RFQ