
|
|
• High Performance, Low Power AVR® 8-Bit Microcontroller Family
|
• Advanced RISC Architecture 131 Powerful Instructions – Most Single Clock Cycle Execution 32 x 8 General Purpose Working Registers Fully Static Operation Up to 20 MIPS Throughput at 20MHz On-chip 2-cycle Multiplier
|
• QTouch® library support Capacitive touch buttons, sliders and wheels QTouch and QMatrix™ acquisition Up to 64 sense channels
|
• Special Microcontroller Features Power-on Reset and Programmable Brown-out Detection Internal Calibrated Oscillator External and Internal Interrupt Sources Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby, and Extended Standby |
|
CATALOG |
ATmega88PA-AUR COUNTRY OF ORIGIN |
ATmega88PA-AUR PARAMETRIC INFO
|
ATmega88PA-AUR PACKAGE INFO
|
ATmega88PA-AUR MANUFACTURING INFO
|
ATmega88PA-AUR PACKAGING INFO
|
ATmega88PA-AUR EACD MODELS
|
|
COUNTRY OF ORIGIN |
Taiwan (Province of China) |
Philippines |
Thailand |
Korea (Republic of) |
|
PARAMETRIC INFO
|
Family Name |
ATmega |
Data Bus Width (bit) |
8 |
Device Core |
AVR |
Instruction Set Architecture |
RISC |
Maximum Clock Rate (MHz) |
20 |
Program Memory Type |
Flash |
Program Memory Size |
8KB |
RAM Size |
1KB |
Maximum CPU Frequency (MHz) |
20 |
Number of Programmable I/Os |
23 |
Number of Timers |
3 |
ADC Channels |
8 |
ADC Resolution (bit) |
10 |
Core Architecture |
AVR |
Number of ADCs |
Single |
PWM |
6 |
Watchdog |
1 |
Analog Comparators |
1 |
Interface Type |
I2C/SPI/TWI/USART |
Programmability |
Yes |
SPI |
2 |
I2C |
1 |
I2S |
0 |
UART |
0 |
USART |
1 |
CAN |
0 |
USB |
0 |
Ethernet |
0 |
Minimum Operating Supply Voltage (V) |
1.8 |
Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Temperature Flag |
Opr |
Supplier Temperature Grade |
Industrial |
Operating Supply Voltage (V) |
2.5|3.3|5 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
Supplier Package |
TQFP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
32 |
Lead Shape |
Gull-wing |
PCB |
32 |
Tab |
N/R |
Pin Pitch (mm) |
0.8 |
Package Length (mm) |
7 |
Package Width (mm) |
7 |
Package Height (mm) |
1.05(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Thin Quad Flat Package |
Package Family Name |
QFP |
Jedec |
MS-026ABA |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
|
|
ECAD MODELS
|

|
|