ATSAM3A4CA-CU Microchip Technology IC MCU 32BIT 256KB FLASH 100BGA

label:
2024/03/15 179



CATALOG
ATSAM3A4CA-CU PARAMETRIC INFO
ATSAM3A4CA-CU PACKAGE INFO
ATSAM3A4CA-CU MANUFACTURING INFO
ATSAM3A4CA-CU PACKAGING INFO
ATSAM3A4CA-CU EACD MODELS


PARAMETRIC INFO
Data Bus Width (bit) 32
Series name SAM3A
Device Core ARM Cortex M3
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 84
Program Memory Type Flash
Program Memory Size 256KB
RAM Size 64KB
Maximum Expanded Memory Size 16MB
Maximum CPU Frequency (MHz) 84
Number of Programmable I/Os 63
Number of Timers 1
ADC Channels 16
DAC Channels 2
ADC Resolution (bit) 12
Number of ADCs Single
Core Architecture ARM
Number of DACs Single
DAC Resolution (bit) 12
PWM 1
Watchdog 1
Special Features CAN Controller
Interface Type CAN/I2C/I2S/SPI/UART/USART/USB
Programmability yes
SPI 4
I2C 2
I2S 1
UART 4
USART 4
CAN 2
USB 1
Ethernet 0
Minimum Operating Supply Voltage (V) 1.62
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 1.8|2.5|3.3


PACKAGE INFO
Supplier packaging LFBGA
Basic package type Ball Grid Array
Number of pins 100
Pin shape Ball
PCB 100
ears N/R
Pin spacing (mm) 0.8
Package length (mm) 9
Package width (mm) 9
Package height (mm) 0.71
Package diameter (mm) N/R
Mounting surface height (mm) 1.1(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Low Profile Fine Pitch Ball Grid Array
Package series name BGA
Package outline Link to datasheet


MANUFACTURING INFO
MSL not applicable
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) SnAgCu
Plating materials not applicable
Terminal Base Material not applicable


PACKAGING INFO
Package Tray


ECAD MODELS

Продукт RFQ