ATSAMD21G18A-AU Microchip Technology IC MCU 32BIT 256KB FLASH 48TQFP

label:
2024/02/23 251



CATALOG
ATSAMD21G18A-AU COUNTRY OF ORIGIN
ATSAMD21G18A-AU PARAMETRIC INFO
ATSAMD21G18A-AU PACKAGE INFO
ATSAMD21G18A-AU MANUFACTURING INFO
ATSAMD21G18A-AU PACKAGING INFO
ATSAMD21G18A-AU ECAD MODELS


COUNTRY OF ORIGIN
Thailand
Korea (Republic of)
Philippines
Taiwan (Province of China)


PARAMETRIC INFO
Data Bus Width (bit) 32
Series name SAM D21
Device Core ARM Cortex M0+
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 48
Program Memory Type Flash
Program Memory Size 256KB
RAM Size 32KB
Maximum CPU Frequency (MHz) 48
DMA Channels 12
Direct Memory Access yes
Floating Point Unit no
Bluetooth no
Wi-Fi no
Multiply Accumulate no
Internal/External Clock Type External
Touch Sensing Interface no
Power On Reset yes
Memory Protection Unit yes
Temperature Sensor yes
DDR no
Memory Management Unit no
Integrated Development Environment no
Super Scalar no
External Bus Interface no
Number of Programmable I/Os 38
Number of Timers 6
ADC Channels 14
DAC Channels 1
ADC Resolution (bit) 12
Number of ADCs Single
Core Architecture ARM
Number of DACs Single
DAC Resolution (bit) 10
PWM 1
Watchdog 1
Analog Comparators 2
Parallel Master Port no
Real Time Clock yes
Interface Type I2C/I2S/SPI/USART/USB
Programmability yes
SPI 6
I2C 6
I2S 1
UART 0
USART 6
CAN 0
USB 1
Ethernet 0
Minimum Operating Supply Voltage (V) 1.62
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.63
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -60


PACKAGE INFO
Supplier packaging TQFP
Basic package type Lead-Frame SMT
Number of pins 48
Pin shape Gull-wing
PCB 48
ears N/R
Pin spacing (mm) 0.5
Package length (mm) 7
Package width (mm) 7
Package height (mm) 1.05(Max)
Package diameter (mm) N/R
Mounting surface height (mm) 1.2(Max)
Install Surface Mount
Package weight (g) 0.14
Packaging materials Plastic
package instruction Thin Quad Flat Package
Package series name QFP
Package outline Link to datasheet


MANUFACTURING INFO
MSL 3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Package Tape and reel packaging
Packing quantity 2500


ECAD MODELS




Продукт RFQ