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• 32-bit load/store AVR32A RISC architecture.
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• 15 general-purpose 32-bit registers.
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• 32-bit Stack Pointer, Program Counter and Link Register reside in register file.
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• Fully orthogonal instruction set.
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• Pipelined architecture allows one instruction per clock cycle for most instructions.
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| CATALOG |
ATUC64D4-AUT COUNTRY OF ORIGIN
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ATUC64D4-AUT PARAMETRIC INFO
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ATUC64D4-AUT PACKAGE INFO
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ATUC64D4-AUT MANUFACTURING INFO
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ATUC64D4-AUT PACKAGING INFO
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ATUC64D4-AUT ECAD MODELS
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COUNTRY OF ORIGIN
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Philippines
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Thailand
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PARAMETRIC INFO
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| Family Name |
ATUC |
| Data Bus Width (bit) |
32 |
| Device Core |
AVR |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
48 |
| Program Memory Type |
Flash |
| Program Memory Size |
64KB |
| RAM Size |
16KB |
| Maximum Expanded Memory Size |
64MB |
| Maximum CPU Frequency (MHz) |
48 |
| GPIO |
35 |
| Number of Timers |
4 |
| ADC Channels |
8 |
| ADC Resolution (bit) |
10 |
| Core Architecture |
AVR |
| Number of ADCs |
1 |
| PWM |
7 |
| Watchdog |
1 |
| Analog Comparators |
8 |
| Interface Type |
SPI/USART/USB |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
0 |
| I2S |
0 |
| UART |
0 |
| USART |
3 |
| CAN |
0 |
| USB |
1 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Typical Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
1.95 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
1.8 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-60 |
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PACKAGE INFO
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| Supplier Package |
TQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
Gull-wing |
| PCB |
48 |
| Tab |
N/R |
| Package Length (mm) |
N/A |
| Package Width (mm) |
N/A |
| Package Height (mm) |
N/A |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/A |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Quad Flat Package |
| Package Family Name |
QFP |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| ECAD MODELS |
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