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| CATALOG |
ATXMEGA256A3U-MH COUNTRY OF ORIGIN
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ATXMEGA256A3U-MH PARAMETRIC INFO
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ATXMEGA256A3U-MH PACKAGE INFO
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ATXMEGA256A3U-MH MANUFACTURING INFO
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ATXMEGA256A3U-MH PACKAGING INFO
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ATXMEGA256A3U-MH ECAD MODELS
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COUNTRY OF ORIGIN
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Korea (Republic of)
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Thailand
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PARAMETRIC INFO
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| Family Name |
XMEGA |
| Data Bus Width (bit) |
8|16 |
| Device Core |
AVR |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
32 |
| Program Memory Type |
Flash |
| Program Memory Size |
256KB |
| RAM Size |
16KB |
| Maximum Expanded Memory Size |
16MB |
| DMA Channels |
4 |
| Maximum CPU Frequency (MHz) |
32 |
| Number of Programmable I/Os |
50 |
| Number of Timers |
7 |
| ADC Channels |
16/16 |
| ADC Resolution (bit) |
12/12 |
| DAC Channels |
2 |
| Core Architecture |
AVR |
| Number of ADCs |
Dual |
| DAC Resolution (bit) |
12 |
| Number of DACs |
Single |
| Watchdog |
1 |
| Analog Comparators |
4 |
| Interface Type |
SPI/TWI/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
0 |
| I2S |
0 |
| UART |
0 |
| USART |
7 |
| CAN |
0 |
| USB |
1 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
1.6 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
No Lead |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
9 |
| Package Width (mm) |
9 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9 |
| Package Overall Width (mm) |
9 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
260 |
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ECAD MODELS
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