
|
|
• High-performance, low-power Atmel® AVR® XMEGA® 8/16-bit Microcontroller
|
• Nonvolatile program and data memories
̶ 64K - 256KBytes of in-system self-programmable flash
̶ 4K - 8KBytes boot section
̶ 2K - 4KBytes EEPROM
̶ 4K - 16KBytes internal SRAM
|
• Special microcontroller features
̶ Power-on reset and programmable brown-out detection
̶ Internal and external clock options with PLL and prescaler
̶ Programmable multilevel interrupt controller
̶ Five sleep modes
|
|
| CATALOG |
| ATxmega64A3U-MHR COUNTRY OF ORIGIN |
ATxmega64A3U-MHR PARAMETRIC INFO
|
ATxmega64A3U-MHR PACKAGE INFO
|
ATxmega64A3U-MHR MANUFACTURING INFO
|
| ATxmega64A3U-MHR PACKAGING INFO
|
ATxmega64A3U-MHR ECAD MODELS
|
|
| COUNTRY OF ORIGIN |
| Thailand |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Data Bus Width (bit) |
8|16 |
| Family Name |
XMEGA |
| Device Core |
AVR |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
32 |
| Program Memory Type |
Flash |
| Program Memory Size |
64KB |
| RAM Size |
4KB |
| Maximum Expanded Memory Size |
16MB |
| Maximum CPU Frequency (MHz) |
32 |
| DMA Channels |
4 |
| Number of Programmable I/Os |
50 |
| Number of Timers |
7 |
| ADC Channels |
8/8 |
| DAC Channels |
2 |
| ADC Resolution (bit) |
12/12 |
| Number of ADCs |
Dual |
| Core Architecture |
AVR |
| Number of DACs |
Single |
| DAC Resolution (bit) |
12 |
| Watchdog |
1 |
| Analog Comparators |
4 |
| Interface Type |
SPI/TWI/USART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
0 |
| I2S |
0 |
| UART |
0 |
| USART |
7 |
| CAN |
0 |
| USB |
1 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
1.6 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
No Lead |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
9 |
| Package Width (mm) |
9 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9 |
| Package Overall Width (mm) |
9 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
|
|
ECAD MODELS
|

|
|