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• High-performance, low-power Atmel® AVR® XMEGA® 8/16-bit Microcontroller
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• Nonvolatile program and data memories
̶ 64K - 256KBytes of in-system self-programmable flash
̶ 4K - 8KBytes boot section
̶ 2K - 4KBytes EEPROM
̶ 4K - 16KBytes internal SRAM
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• Special microcontroller features
̶ Power-on reset and programmable brown-out detection
̶ Internal and external clock options with PLL and prescaler
̶ Programmable multilevel interrupt controller
̶ Five sleep modes
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CATALOG |
ATxmega64A3U-MHR COUNTRY OF ORIGIN |
ATxmega64A3U-MHR PARAMETRIC INFO
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ATxmega64A3U-MHR PACKAGE INFO
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ATxmega64A3U-MHR MANUFACTURING INFO
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ATxmega64A3U-MHR PACKAGING INFO
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ATxmega64A3U-MHR ECAD MODELS
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COUNTRY OF ORIGIN |
Thailand |
Taiwan (Province of China) |
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PARAMETRIC INFO
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Data Bus Width (bit) |
8|16 |
Family Name |
XMEGA |
Device Core |
AVR |
Instruction Set Architecture |
RISC |
Maximum Clock Rate (MHz) |
32 |
Program Memory Type |
Flash |
Program Memory Size |
64KB |
RAM Size |
4KB |
Maximum Expanded Memory Size |
16MB |
Maximum CPU Frequency (MHz) |
32 |
DMA Channels |
4 |
Number of Programmable I/Os |
50 |
Number of Timers |
7 |
ADC Channels |
8/8 |
DAC Channels |
2 |
ADC Resolution (bit) |
12/12 |
Number of ADCs |
Dual |
Core Architecture |
AVR |
Number of DACs |
Single |
DAC Resolution (bit) |
12 |
Watchdog |
1 |
Analog Comparators |
4 |
Interface Type |
SPI/TWI/USART/USB |
Programmability |
Yes |
SPI |
3 |
I2C |
0 |
I2S |
0 |
UART |
0 |
USART |
7 |
CAN |
0 |
USB |
1 |
Ethernet |
0 |
Minimum Operating Supply Voltage (V) |
1.6 |
Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Temperature Flag |
Opr |
Operating Supply Voltage (V) |
1.8|2.5|3.3 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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Supplier Package |
VQFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
64 |
Lead Shape |
No Lead |
PCB |
64 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
9 |
Package Width (mm) |
9 |
Package Height (mm) |
0.88 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
9 |
Package Overall Width (mm) |
9 |
Package Overall Height (mm) |
0.9 |
Seated Plane Height (mm) |
0.9 |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Jedec |
N/A |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
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ECAD MODELS
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