|
|
| • Exceptionally Low RMS Jitter: < 80fs Typ (150fs Max @ 156.25MHz) |
| • Available in industry standard frequencies between |
| • 100MHz and 212.5MHz |
| • Lowest power consumption in its class(16mA Typ LVDS @ 156.25MHz) |
| • ±25ppm stability over industrial operating temperature (-40 to +85ºC) |
| • 3.3V, 2.5V, 1.8V supply voltage options |
|
| CATALOG |
AX3DAF1-125.0000 COUNTRY OF ORIGIN
|
AX3DAF1-125.0000 PARAMETRIC INFO
|
AX3DAF1-125.0000 PACKAGE INFO
|
AX3DAF1-125.0000 MANUFACTURING INFO
|
AX3DAF1-125.0000 PACKAGING INFO
|
AX3DAF1-125.0000 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Japan
|
|
PARAMETRIC INFO
|
| Type |
Crystal Oscillator |
| Programmability |
No |
| Standard Frequency (MHz) |
125 |
| Frequency Stability (ppm) |
±50 |
| Output Level |
LVDS |
| Frequency Aging (ppm/Year) |
±15 (20th) |
| Maximum Symmetry (%) |
55 |
| Minimum Operating Supply Voltage (V) |
2.97 |
| Maximum Rise Time (ns) |
0.4 |
| Maximum Fall Time (ns) |
0.4 |
| Output Control Function |
Output Enable |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
3.63 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
N/A |
| Pin Count |
6 |
| PCB |
6 |
| Tab |
N/R |
| Package Length (mm) |
3.2 |
| Package Width (mm) |
2.5 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.2 |
| Package Overall Width (mm) |
2.5 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
2 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Bulk |
| Quantity Of Packaging |
250(Min) |
| Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
• PCI Express
|
• 10G/40G/100G optical Ethernet
|
• Networking & communication
|
| • RF systems, base stations (BTS) |
| • Data center |
| • Test & measurement |
| |
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