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• Guard Ring Die Construction for Transient Protection
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• Ideally Suited for Automated Assembly
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• Low Power Loss, High Efficiency
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• For Use in Low Voltage Drop, High Frequency Inverters, Free Wheeling, and Polarity Protection Application
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• Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
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• Halogen and Antimony Free. “Green” Device (Note 3)
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• For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities),please contact us or your local Diodes representative.https://www.diodes.com/quality/product-definitions/
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| CATALOG |
B2100-13-F PARAMETRIC INFO
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B2100-13-F PACKAGE INFO
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B2100-13-F MANUFACTURING INFO
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B2100-13-F PACKAGING INFO
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B2100-13-F ECAD MODELS
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B2100-13-F APPLICATIONS
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PARAMETRIC INFO
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| Type |
Schottky Diode |
| Configuration |
Single |
| Peak Reverse Repetitive Voltage (V) |
100 |
| Maximum DC Reverse Voltage (V) |
100 |
| Maximum Continuous Forward Current (A) |
2 |
| Peak Forward Voltage (V) |
0.79 |
| Peak Non-Repetitive Surge Current (A) |
50 |
| Maximum RMS Reverse Voltage (V) |
70 |
| Peak Reverse Current (uA) |
500 |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Diode Capacitance (pF) |
75 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SMB |
Basic Package Type
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Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
J-Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.57(Max) |
| Package Width (mm) |
3.94(Max) |
| Package Height (mm) |
2.3(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.59(Max) |
| Package Overall Width (mm) |
3.94(Max) |
| Package Overall Height (mm) |
2.5(Max) |
| Seated Plane Height (mm) |
2.5(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.096 |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-214AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
13 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Cathode At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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| ECAD MODELS |
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| APPLICATIONS |
• Polarity Protection Diode
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• Re-Circulating Diode
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• Blocking Diode
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• DC-DC
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• AC-DC
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