|
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• Temperature range up to +125 °C
|
• Very high rated current
|
• Low DC resistance
|
• Suitable for lead-free reflow soldering
|
• RoHS-compatible
|
|
| CATALOG |
B82477G4104M000 COUNTRY OF ORIGIN
|
B82477G4104M000 PARAMETRIC INFO
|
B82477G4104M000 PACKAGE INFO
|
B82477G4104M000 MANUFACTURING INFO
|
B82477G4104M000 PACKAGING INFO
|
B82477G4104M000 ECAD MODELS
|
B82477G4104M000 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
Power |
| Technology |
Wirewound |
| Protection Style |
Shielded |
| Core Material |
Ferrite |
| Inductance (H) |
100u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
100K |
| Maximum DC Current (A) |
1.7 |
| Typical Temperature Rise (°C) |
40 |
| Maximum Saturation Current (A) |
1.95 |
| Inductance Decrease Percentage @ Isat (%) |
10 |
| Maximum DC Resistance (Ohm) |
0.165 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-55 |
| Operating Temperature (°C) |
-55 to 125 |
| Polarity |
No |
| Maximum Terminal Width (mm) |
1.7 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
|
|
PACKAGE INFO
|
| Case Size |
N/A |
| Maximum Product Length (mm) |
12.8 |
| Maximum Product Depth (mm) |
12.8 |
| Maximum Product Height (mm) |
8 |
| Maximum Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
4.2 |
| Package Shape |
Square |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Type |
SMD |
| Product Length (mm) |
N/A |
| Product Depth (mm) |
N/A |
| Product Height (mm) |
N/A |
| Product Diameter (mm) |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Electro Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
CuSnP |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Blister |
|
|
| ECAD MODELS |
|
|
APPLICATIONS
|
• DC/DC converters
|
• EDP (Electronic Data Processing)
|
• Consumer electronics
|
• Industrial electronics
|
|
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