|
|
• High switching speed: trr 50 ns
|
• Low leakage current
|
• Repetitive peak reverse voltage:
VRRM 250 V
|
• Low capacitance: Cd 2 pF
|
• Small SMD plastic package
|
|
| CATALOG |
BAV23C,215 COUNTRY OF ORIGIN
|
BAV23C,215 PARAMETRIC INFO
|
BAV23C,215 PACKAGE INFO
|
BAV23C,215 MANUFACTURING INFO
|
BAV23C,215 PACKAGING INFO
|
BAV23C,215 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
Switching Diode |
| Configuration |
Dual Common Cathode |
| Maximum DC Reverse Voltage (V) |
200 |
| Peak Reverse Repetitive Voltage (V) |
250 |
| Maximum Continuous Forward Current (A) |
0.225 |
| Maximum Power Dissipation (mW) |
250 |
| Speed |
Ultra Fast Recovery Rectifier |
| Maximum Junction Ambient Thermal Resistance |
500K/W |
| Peak Forward Voltage (V) |
1.25@0.2A |
| Peak Non-Repetitive Surge Current (A) |
9 |
| Peak Reverse Current (uA) |
0.1 |
| Peak Reverse Recovery Time (ns) |
50 |
| Operating Junction Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Diode Capacitance (pF) |
2 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Automotive |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3(Max) |
| Package Overall Width (mm) |
2.5(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
3 |
| Minimum PACKAGE_DIMENSION_L |
2.8 |
| Maximum PACKAGE_DIMENSION_W |
1.4 |
| Minimum PACKAGE_DIMENSION_W |
1.2 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
0.9 |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
CuAg |
| Terminal Base Material |
FeNi Alloy |
| Number of Wave Cycles |
1 |
|
|
PACKAGING INFO
|
| Packaging Suffix |
215 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
|
|
APPLICATIONS
|
• High-speed switching at high voltage
|
• High-voltage general-purpose switching
|
|
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