BCW66GLT1G onsemi TRANS NPN 45V 0.8A SOT-23

label:
2024/03/28 220

• S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant


CATALOG
BCW66GLT1G COUNTRY OF ORIGIN
BCW66GLT1G PARAMETRIC INFO
BCW66GLT1G PACKAGE INFO
BCW66GLT1G MANUFACTURING INFO
BCW66GLT1G PACKAGING INFO
BCW66GLT1G EACD MODELS


COUNTRY OF ORIGIN
China
Malaysia


PARAMETRIC INFO
type NPN
Configuration Single
Maximum Collector-Emitter Voltage (V) 45
Maximum Collector Base Voltage (V) 75
Maximum Emitter Base Voltage (V) 5
Maximum DC Collector Current (A) 0.8
Material Si
Maximum Power Dissipation (mW) 300
Maximum Junction Ambient Thermal Resistance 556°C/W
Maximum Noise Figure (dB) 10
Maximum Turn-Off Time (ns) 400
Maximum Collector-Emitter Saturation Voltage (V) 0.3@10mA@100mA|0.7@50mA@500mA
Maximum Base Emitter Saturation Voltage (V) 2@50mA@500mA
Category Bipolar Small Signal
Minimum DC Current Gain 50@100uA@10V|110@10mA@1V|160@100mA@1V|60@500mA@2V
Number of Elements per Chip 1
Maximum Turn-On Time (ns) 100
Maximum Transition Frequency (MHz) 100(Min)
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier packaging SOT-23
Basic package type Lead-Frame SMT
Number of pins 3
Pin shape Gull-wing
PCB 3
ears N/R
Pin spacing (mm) 0.95
Package length (mm) 2.9
Package width (mm) 1.3
Package height (mm) 0.94
Package diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1
Mounting surface height (mm) 1
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Small Outline Transistor
Package series name SOT
JEDEC TO-236AB
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard not applicable
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material FeNiAlloy


PACKAGING INFO
Packaging Suffix T1
Package Tape and reel packaging
Packing quantity 3000


ECAD MODELS

Продукт RFQ